Part Details for MT47H64M8SH-187E:H by Micron Technology Inc
Overview of MT47H64M8SH-187E:H by Micron Technology Inc
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for MT47H64M8SH-187E:H
Part # | Distributor | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
DISTI #
MT47H64M8SH-187E:H
|
Avnet Americas | DDR2 512M 64MX8 FBGA - Trays (Alt: MT47H64M8SH-187E:H) RoHS: Compliant Min Qty: 1518 Package Multiple: 1518 Container: Tray | 0 |
|
RFQ |
Part Details for MT47H64M8SH-187E:H
MT47H64M8SH-187E:H CAD Models
MT47H64M8SH-187E:H Part Data Attributes
|
MT47H64M8SH-187E:H
Micron Technology Inc
Buy Now
Datasheet
|
Compare Parts:
MT47H64M8SH-187E:H
Micron Technology Inc
DDR DRAM, 64MX8, 0.35ns, CMOS, PBGA60, 8 X 10 MM, ROHS COMPLIANT, FBGA-60
|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | MICRON TECHNOLOGY INC | |
Part Package Code | BGA | |
Package Description | TFBGA, BGA60,9X11,32 | |
Pin Count | 60 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.28 | |
Access Mode | FOUR BANK PAGE BURST | |
Access Time-Max | 0.35 ns | |
Additional Feature | AUTO/SELF REFRESH | |
Clock Frequency-Max (fCLK) | 533 MHz | |
I/O Type | COMMON | |
Interleaved Burst Length | 4,8 | |
JESD-30 Code | R-PBGA-B60 | |
JESD-609 Code | e1 | |
Length | 10 mm | |
Memory Density | 536870912 bit | |
Memory IC Type | DDR2 DRAM | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Ports | 1 | |
Number of Terminals | 60 | |
Number of Words | 67108864 words | |
Number of Words Code | 64000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | ||
Organization | 64MX8 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TFBGA | |
Package Equivalence Code | BGA60,9X11,32 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
Qualification Status | Not Qualified | |
Refresh Cycles | 8192 | |
Seated Height-Max | 1.2 mm | |
Self Refresh | YES | |
Sequential Burst Length | 4,8 | |
Standby Current-Max | 0.01 A | |
Supply Current-Max | 0.16 mA | |
Supply Voltage-Max (Vsup) | 1.9 V | |
Supply Voltage-Min (Vsup) | 1.7 V | |
Supply Voltage-Nom (Vsup) | 1.8 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | OTHER | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Width | 8 mm |