Part Details for MT47H128M8BT-3 by Micron Technology Inc
Overview of MT47H128M8BT-3 by Micron Technology Inc
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Part Details for MT47H128M8BT-3
MT47H128M8BT-3 CAD Models
MT47H128M8BT-3 Part Data Attributes:
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MT47H128M8BT-3
Micron Technology Inc
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MT47H128M8BT-3
Micron Technology Inc
DDR DRAM, 128MX8, 0.45ns, CMOS, PBGA92
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | MICRON TECHNOLOGY INC | |
| Package Description | FBGA, BGA92,9X21,32 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.32 | |
| Access Time-Max | 0.45 ns | |
| Clock Frequency-Max (fCLK) | 333 MHz | |
| I/O Type | COMMON | |
| Interleaved Burst Length | 4,8 | |
| JESD-30 Code | R-PBGA-B92 | |
| Memory Density | 1073741824 bit | |
| Memory IC Type | DDR2 DRAM | |
| Memory Width | 8 | |
| Number of Terminals | 92 | |
| Number of Words | 134217728 words | |
| Number of Words Code | 128000000 | |
| Organization | 128MX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FBGA | |
| Package Equivalence Code | BGA92,9X21,32 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Refresh Cycles | 8192 | |
| Sequential Burst Length | 4,8 | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM |