Part Details for MT41K256M8HX-15EIT:D by Micron Technology Inc
Overview of MT41K256M8HX-15EIT:D by Micron Technology Inc
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Applications
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
Available Datasheets
Part # | Manufacturer | Description | Datasheet |
---|---|---|---|
DBL5W5P543A40LF | Amphenol Communications Solutions | D-Sub Power Board Mount Connectors, Input Output Connectors, Full Power 5W5 Pin Right Angle Solder 40A, Europe Standard, 500 Cycles, Front: Threaded Insert M3, Back: Without Accessory on PCB. | |
DEL2V2P543H40LF | Amphenol Communications Solutions | D-Sub Power Board Mount Connectors, Input Output Connectors, Full Power 2V2 Pin Right Angle Solder 40A, Europe Standard, 500 Cycles, Front: Threaded Insert M3, Back: Harpoons for 2.4mm PCB Thickness. | |
DC8W8P500H30LF | Amphenol Communications Solutions | D-Sub Power Board Mount Connectors, Input Output Connectors, Full Power 8W8 Pin Right Angle Solder 30A, Europe Standard, 200 Cycles, Front: Without Accessory, Back: Harpoons for 2.4mm PCB Thickness. |
Part Details for MT41K256M8HX-15EIT:D
MT41K256M8HX-15EIT:D CAD Models
MT41K256M8HX-15EIT:D Part Data Attributes
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MT41K256M8HX-15EIT:D
Micron Technology Inc
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Datasheet
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MT41K256M8HX-15EIT:D
Micron Technology Inc
DDR DRAM, 256MX8, CMOS, PBGA78, FBGA-78
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Part Life Cycle Code | Active | |
Ihs Manufacturer | MICRON TECHNOLOGY INC | |
Package Description | TFBGA, | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.36 | |
Access Mode | MULTI BANK PAGE BURST | |
Additional Feature | AUTO/SELF REFRESH | |
JESD-30 Code | R-PBGA-B78 | |
Length | 11.5 mm | |
Memory Density | 2147483648 bit | |
Memory IC Type | DDR3L DRAM | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Ports | 1 | |
Number of Terminals | 78 | |
Number of Words | 268435456 words | |
Number of Words Code | 256000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 256MX8 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TFBGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
Seated Height-Max | 1.2 mm | |
Self Refresh | YES | |
Supply Voltage-Max (Vsup) | 1.45 V | |
Supply Voltage-Min (Vsup) | 1.283 V | |
Supply Voltage-Nom (Vsup) | 1.35 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Width | 9 mm |