Part Details for MT41J256M16HA-093:E by Micron Technology Inc
Overview of MT41J256M16HA-093:E by Micron Technology Inc
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
Price & Stock for MT41J256M16HA-093:E
| Part # | Distributor | Description | Stock | Price | Buy | |
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Bristol Electronics | 38 |
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RFQ | ||
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Quest Components | DDR DRAM | 7 |
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$2.1000 / $2.8000 | Buy Now |
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Chip1Cloud | DRAM Chip DDR3 SDRAM 4Gbit 256Mx16 1.5V 96-Pin FBGA | IC DRAM 4G PARALLEL 96FBGA | 27900 |
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RFQ | |
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Win Source Electronics | DRAM Chip DDR3 SDRAM 4Gbit 256Mx16 1.5V 96-Pin FBGA | IC DRAM 4G PARALLEL 96FBGA | 19785 |
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$7.5370 / $11.3050 | Buy Now |
Part Details for MT41J256M16HA-093:E
MT41J256M16HA-093:E CAD Models
MT41J256M16HA-093:E Part Data Attributes:
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MT41J256M16HA-093:E
Micron Technology Inc
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Datasheet
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MT41J256M16HA-093:E
Micron Technology Inc
DDR DRAM, 256MX16, 0.18ns, CMOS, PBGA96, FBGA-96
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | MICRON TECHNOLOGY INC | |
| Package Description | TFBGA, BGA96,9X16,32 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.36 | |
| Samacsys Manufacturer | Micron | |
| Access Mode | MULTI BANK PAGE BURST | |
| Access Time-Max | 0.18 ns | |
| Additional Feature | AUTO/SELF REFRESH | |
| Clock Frequency-Max (fCLK) | 1066 MHz | |
| I/O Type | COMMON | |
| Interleaved Burst Length | 8 | |
| JESD-30 Code | R-PBGA-B96 | |
| JESD-609 Code | e1 | |
| Length | 14 mm | |
| Memory Density | 4294967296 bit | |
| Memory IC Type | DDR3 DRAM | |
| Memory Width | 16 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 96 | |
| Number of Words | 268435456 words | |
| Number of Words Code | 256000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | ||
| Organization | 256MX16 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA96,9X16,32 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Refresh Cycles | 8192 | |
| Seated Height-Max | 1.2 mm | |
| Self Refresh | YES | |
| Sequential Burst Length | 8 | |
| Standby Current-Max | 0.018 A | |
| Supply Current-Max | 0.305 mA | |
| Supply Voltage-Max (Vsup) | 1.575 V | |
| Supply Voltage-Min (Vsup) | 1.425 V | |
| Supply Voltage-Nom (Vsup) | 1.5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 9 mm |