Part Details for MT29F4G01ABBFD12-AUT:F by Micron Technology Inc
Overview of MT29F4G01ABBFD12-AUT:F by Micron Technology Inc
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for MT29F4G01ABBFD12-AUT:F
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
51AK1333
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Newark | Flash Memory, 4Gbit, -40 To 125Deg C Rohs Compliant: Yes |Micron MT29F4G01ABBFD12-AUT:F RoHS: Compliant Min Qty: 1 Package Multiple: 1 Date Code: 1 Container: Bulk | 492 |
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$4.1500 / $7.1800 | Buy Now |
|
DISTI #
557-MT29F4G01ABBFD12-AUT:F-ND
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DigiKey | IC FLASH 4GBIT SPI 24TPBGA Min Qty: 1122 Lead time: 6 Weeks Container: Box | Temporarily Out of Stock |
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$4.4389 | Buy Now |
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DISTI #
MT29F4G01ABBFD12-A
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Avnet Americas | Flash Memory, SLC NAND, 4 Gbit, 4G x 1bit, SPI, TBGA, 24 Pins - Trays (Alt: MT29F4G01ABBFD12-A) RoHS: Compliant Min Qty: 1122 Package Multiple: 1122 Lead time: 12 Weeks, 0 Days Container: Tray | 0 |
|
$4.2001 | Buy Now |
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DISTI #
340-642840
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Mouser Electronics | NAND Flash SLC 4G 4GX1 TBGA M70A RoHS: Compliant | 0 |
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$4.3300 | Order Now |
Part Details for MT29F4G01ABBFD12-AUT:F
MT29F4G01ABBFD12-AUT:F CAD Models
MT29F4G01ABBFD12-AUT:F Part Data Attributes
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MT29F4G01ABBFD12-AUT:F
Micron Technology Inc
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Datasheet
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Compare Parts:
MT29F4G01ABBFD12-AUT:F
Micron Technology Inc
Flash, 512MX8, PBGA24, TBGA-24
|
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | MICRON TECHNOLOGY INC | |
| Package Description | TBGA-24 | |
| Reach Compliance Code | compliant | |
| Factory Lead Time | 12 Weeks | |
| Clock Frequency-Max (fCLK) | 133 MHz | |
| Data Retention Time-Min | 10 | |
| Endurance | 100000 Write/Erase Cycles | |
| JESD-30 Code | R-PBGA-B24 | |
| Length | 8 mm | |
| Memory Density | 4294967296 bit | |
| Memory IC Type | FLASH | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 24 | |
| Number of Words | 536870912 words | |
| Number of Words Code | 512000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 512MX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TBGA | |
| Package Equivalence Code | BGA24,5X5,40 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE | |
| Parallel/Serial | SERIAL | |
| Programming Voltage | 1.8 V | |
| Screening Level | AEC-Q100 | |
| Seated Height-Max | 1.2 mm | |
| Serial Bus Type | QSPI | |
| Standby Current-Max | 0.0001 A | |
| Supply Current-Max | 0.035 mA | |
| Supply Voltage-Max (Vsup) | 1.95 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Type | SLC NAND TYPE | |
| Width | 6 mm | |
| Write Protection | HARDWARE/SOFTWARE |