Datasheets
MSP430F5131IYFFR by: Texas Instruments

25 MHz MCU with 8KB Flash, 1KB SRAM, comparator, DMA, 16-bit High Resolution timer 40-DSBGA -40 to 85

Part Details for MSP430F5131IYFFR by Texas Instruments

Overview of MSP430F5131IYFFR by Texas Instruments

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Applications Environmental Monitoring Internet of Things (IoT) Industrial Automation Smart Cities Agriculture Technology Renewable Energy Robotics and Drones

Price & Stock for MSP430F5131IYFFR

Part # Distributor Description Stock Price Buy
DISTI # MSP430F5131IYFFR-ND
DigiKey IC MCU 16BIT 8KB FLASH 40DSBGA Min Qty: 3000 Lead time: 18 Weeks Container: Tape & Reel (TR) Temporarily Out of Stock
  • 3,000 $1.3540
$1.3540 Buy Now
DISTI # 595-MSP430F5131IYFFR
Mouser Electronics 16-bit Microcontrollers - MCU Mixed Signal Microcontroller RoHS: Compliant 0
  • 3,000 $1.3500
  • 6,000 $1.3000
$1.3000 / $1.3500 Order Now
Ameya Holding Limited   5527
RFQ

Part Details for MSP430F5131IYFFR

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MSP430F5131IYFFR Part Data Attributes

MSP430F5131IYFFR Texas Instruments
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MSP430F5131IYFFR Texas Instruments 25 MHz MCU with 8KB Flash, 1KB SRAM, comparator, DMA, 16-bit High Resolution timer 40-DSBGA -40 to 85
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer TEXAS INSTRUMENTS INC
Part Package Code BGA
Package Description VFBGA, BGA40,6X7,16
Pin Count 40
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.31.00.01
Has ADC YES
Additional Feature ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 12 MHZ
Address Bus Width
Bit Size 16
Boundary Scan YES
CPU Family MSP430
Clock Frequency-Max 32 MHz
DAC Channels NO
DMA Channels YES
External Data Bus Width
Integrated Cache NO
JESD-30 Code R-PBGA-B40
JESD-609 Code e1
Length 3.06 mm
Low Power Mode YES
Moisture Sensitivity Level 1
Number of DMA Channels 3
Number of I/O Lines 31
Number of Terminals 40
On Chip Program ROM Width 8
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
PWM Channels YES
Package Body Material PLASTIC/EPOXY
Package Code VFBGA
Package Equivalence Code BGA40,6X7,16
Package Shape RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260
RAM (bytes) 1024
ROM (words) 8192
ROM Programmability FLASH
Seated Height-Max 0.625 mm
Speed 25 MHz
Supply Current-Max 6.15 mA
Supply Voltage-Max 3.6 V
Supply Voltage-Min 3 V
Supply Voltage-Nom 3 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 0.4 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 2.76 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC

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