Part Details for MSM511000B-60RS by LAPIS Semiconductor Co Ltd
Overview of MSM511000B-60RS by LAPIS Semiconductor Co Ltd
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- Part Data Attributes: (Available)
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Applications
Education and Research
Consumer Electronics
Computing and Data Storage
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| PHEC60R-S211LF | Amphenol Communications Solutions | PHEN/PHEC Board-to-Board Connector, Straight Receptacle, 1.27mm (0.05inch). |
Part Details for MSM511000B-60RS
MSM511000B-60RS CAD Models
MSM511000B-60RS Part Data Attributes
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MSM511000B-60RS
LAPIS Semiconductor Co Ltd
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Datasheet
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MSM511000B-60RS
LAPIS Semiconductor Co Ltd
Fast Page DRAM, 1MX1, 60ns, CMOS, PDIP18
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | LAPIS SEMICONDUCTOR CO LTD | |
| Package Description | DIP, DIP18,.3 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.02 | |
| Access Time-Max | 60 ns | |
| I/O Type | SEPARATE | |
| JESD-30 Code | R-PDIP-T18 | |
| JESD-609 Code | e0 | |
| Memory Density | 1048576 bit | |
| Memory IC Type | FAST PAGE DRAM | |
| Memory Width | 1 | |
| Number of Terminals | 18 | |
| Number of Words | 1048576 words | |
| Number of Words Code | 1000000 | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 1MX1 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | DIP | |
| Package Equivalence Code | DIP18,.3 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Qualification Status | Not Qualified | |
| Refresh Cycles | 512 | |
| Standby Current-Max | 0.001 A | |
| Supply Current-Max | 0.09 mA | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL |