Part Details for MSC8156ETAG1000B by NXP Semiconductors
Overview of MSC8156ETAG1000B by NXP Semiconductors
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Computing and Data Storage
Price & Stock for MSC8156ETAG1000B
| Part # | Distributor | Description | Stock | Price | Buy | |
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Chip1Cloud | IC DSP 6X 1GHZ SC3850 783FCBGA | 3270 |
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RFQ | |
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Flip Electronics | Stock | 36 |
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RFQ |
Part Details for MSC8156ETAG1000B
MSC8156ETAG1000B CAD Models
MSC8156ETAG1000B Part Data Attributes:
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MSC8156ETAG1000B
NXP Semiconductors
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Datasheet
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Compare Parts:
MSC8156ETAG1000B
NXP Semiconductors
OTHER DSP
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | BGA, BGA783,28X28,40 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.1 | |
| HTS Code | 8542.31.00.01 | |
| Samacsys Manufacturer | NXP | |
| Bit Size | 32 | |
| Format | FIXED POINT | |
| JESD-30 Code | S-PBGA-B783 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 783 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA783,28X28,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 245 | |
| Qualification Status | Not Qualified | |
| RAM (words) | 8192 | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| uPs/uCs/Peripheral ICs Type | DIGITAL SIGNAL PROCESSOR, OTHER |