Part Details for MSC8152SAG1000B by Freescale Semiconductor
Overview of MSC8152SAG1000B by Freescale Semiconductor
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Applications
Industrial Automation
Renewable Energy
Robotics and Drones
Part Details for MSC8152SAG1000B
MSC8152SAG1000B CAD Models
MSC8152SAG1000B Part Data Attributes:
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MSC8152SAG1000B
Freescale Semiconductor
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Datasheet
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MSC8152SAG1000B
Freescale Semiconductor
StarCore DSP, 2x 1GHz SC3850 cores, MAPLE-B accelerator, DDR2/3, SRIO, PCIe, QE, GbE, 0-105C
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | FREESCALE SEMICONDUCTOR INC | |
| Package Description | 29 X 29 MM, LEAD FREE, PLASTIC, FCBGA-783 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.A.1 | |
| HTS Code | 8542.31.00.01 | |
| Address Bus Width | 16 | |
| Boundary Scan | YES | |
| External Data Bus Width | 64 | |
| Format | FIXED POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-PBGA-B783 | |
| JESD-609 Code | e1 | |
| Length | 29 mm | |
| Low Power Mode | YES | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 783 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Peak Reflow Temperature (Cel) | 245 | |
| Seated Height-Max | 3.94 mm | |
| Speed | 1000 MHz | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 0.97 V | |
| Supply Voltage-Nom | 1 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 29 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |