Part Details for MSC8103M1200F by Freescale Semiconductor
Overview of MSC8103M1200F by Freescale Semiconductor
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (2 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (2 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Industrial Automation
Healthcare
Renewable Energy
Robotics and Drones
Price & Stock for MSC8103M1200F
Part # | Distributor | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
|
Chip1Cloud | Network Digital Signal Processor | 6800 |
|
RFQ |
Part Details for MSC8103M1200F
MSC8103M1200F CAD Models
MSC8103M1200F Part Data Attributes
|
MSC8103M1200F
Freescale Semiconductor
Buy Now
Datasheet
|
Compare Parts:
MSC8103M1200F
Freescale Semiconductor
64-BIT, 75MHz, OTHER DSP, PBGA332, 17 X 17 MM, FLIP-CHIP, PLASTIC, BGA-332
|
Rohs Code | No | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | FREESCALE SEMICONDUCTOR INC | |
Part Package Code | BGA | |
Package Description | FBGA, BGA332,19X19,32 | |
Pin Count | 332 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A991 | |
HTS Code | 8542.31.00.01 | |
Address Bus Width | 32 | |
Barrel Shifter | NO | |
Bit Size | 16 | |
Boundary Scan | YES | |
Clock Frequency-Max | 75 MHz | |
External Data Bus Width | 64 | |
Format | FIXED POINT | |
Internal Bus Architecture | MULTIPLE | |
JESD-30 Code | S-PBGA-B332 | |
JESD-609 Code | e0 | |
Length | 17 mm | |
Low Power Mode | YES | |
Moisture Sensitivity Level | 3 | |
Number of Terminals | 332 | |
Operating Temperature-Max | 75 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | FBGA | |
Package Equivalence Code | BGA332,19X19,32 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, FINE PITCH | |
Peak Reflow Temperature (Cel) | 220 | |
Qualification Status | Not Qualified | |
RAM (words) | 262144 | |
Seated Height-Max | 3.18 mm | |
Supply Voltage-Max | 1.7 V | |
Supply Voltage-Min | 1.55 V | |
Supply Voltage-Nom | 1.6 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | OTHER | |
Terminal Finish | Tin/Lead/Silver (Sn/Pb/Ag) | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 17 mm | |
uPs/uCs/Peripheral ICs Type | DIGITAL SIGNAL PROCESSOR, OTHER |
Alternate Parts for MSC8103M1200F
This table gives cross-reference parts and alternative options found for MSC8103M1200F. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MSC8103M1200F, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
MSC8103VT1200F | 64-BIT, 75 MHz, OTHER DSP, PBGA332, 17 X 17 MM, FLIP-CHIP, PLASTIC, BGA-332 | Freescale Semiconductor | MSC8103M1200F vs MSC8103VT1200F |
MSC8103M1200F | 64-BIT, 75MHz, OTHER DSP, PBGA332, 17 X 17 MM, FLIP-CHIP, PLASTIC, BGA-332 | Motorola Mobility LLC | MSC8103M1200F vs MSC8103M1200F |