Datasheets
MSC8103M1100F by:

IC,DSP,16-BIT,BGA,332PIN,PLASTIC

Part Details for MSC8103M1100F by Freescale Semiconductor

Overview of MSC8103M1100F by Freescale Semiconductor

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Applications Industrial Automation Healthcare Renewable Energy Robotics and Drones

Price & Stock for MSC8103M1100F

Part # Distributor Description Stock Price Buy
DISTI # 2156-MSC8103M1100F-ND
DigiKey DSP, 16 BIT SIZE, 64-EXT BIT, 68 Min Qty: 3 Lead time: 1 Weeks Container: Bulk MARKETPLACE PRODUCT 4320
In Stock
  • 3 $109.7100
$109.7100 Buy Now
Bristol Electronics   494
RFQ
Rochester Electronics Digital Signal Processor, 16-Bit Size, 64-Ext Bit, 68.75MHz PBGA332 RoHS: Not Compliant pbFree: No Status: Obsolete Min Qty: 1 4320
  • 1 $105.4900
  • 25 $103.3800
  • 100 $99.1600
  • 500 $94.9400
  • 1,000 $89.6700
$89.6700 / $105.4900 Buy Now

Part Details for MSC8103M1100F

MSC8103M1100F CAD Models

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MSC8103M1100F Part Data Attributes

MSC8103M1100F Freescale Semiconductor
Buy Now Datasheet
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MSC8103M1100F Freescale Semiconductor IC,DSP,16-BIT,BGA,332PIN,PLASTIC
Rohs Code No
Part Life Cycle Code Transferred
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC
Part Package Code BGA
Package Description 17 X 17 MM, FLIP-CHIP, PLASTIC, BGA-332
Pin Count 332
Reach Compliance Code not_compliant
ECCN Code 3A991
HTS Code 8542.31.00.01
Address Bus Width 32
Barrel Shifter NO
Bit Size 16
Boundary Scan YES
Clock Frequency-Max 68.75 MHz
External Data Bus Width 64
Format FIXED POINT
Internal Bus Architecture MULTIPLE
JESD-30 Code S-PBGA-B332
JESD-609 Code e0
Length 17 mm
Low Power Mode YES
Moisture Sensitivity Level 3
Number of Terminals 332
Operating Temperature-Max 105 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code FBGA
Package Equivalence Code BGA332,19X19,32
Package Shape SQUARE
Package Style GRID ARRAY, FINE PITCH
Peak Reflow Temperature (Cel) 220
Qualification Status Not Qualified
RAM (words) 262144
Seated Height-Max 3.18 mm
Supply Voltage-Max 1.7 V
Supply Voltage-Min 1.5 V
Supply Voltage-Nom 1.6 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish Tin/Lead/Silver (Sn/Pb/Ag)
Terminal Form BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 17 mm
uPs/uCs/Peripheral ICs Type DIGITAL SIGNAL PROCESSOR, OTHER

Alternate Parts for MSC8103M1100F

This table gives cross-reference parts and alternative options found for MSC8103M1100F. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MSC8103M1100F, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
MSC8103VT1100F Freescale Semiconductor Check for Price 64-BIT, 68.75MHz, OTHER DSP, PBGA332, 17 X 17 MM, FLIP-CHIP, PLASTIC, BGA-332 MSC8103M1100F vs MSC8103VT1100F
MSC8103M1100F Motorola Mobility LLC Check for Price 64-BIT, 68.75MHz, OTHER DSP, PBGA332, 17 X 17 MM, FLIP-CHIP, PLASTIC, BGA-332 MSC8103M1100F vs MSC8103M1100F

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