Part Details for MSC2340-10KS9 by LAPIS Semiconductor Co Ltd
Overview of MSC2340-10KS9 by LAPIS Semiconductor Co Ltd
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Applications
Energy and Power Systems
Renewable Energy
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Part Details for MSC2340-10KS9
MSC2340-10KS9 CAD Models
MSC2340-10KS9 Part Data Attributes
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MSC2340-10KS9
LAPIS Semiconductor Co Ltd
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MSC2340-10KS9
LAPIS Semiconductor Co Ltd
Fast Page DRAM Module, 4MX9, 100ns, CMOS,
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Rohs Code | No | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | LAPIS SEMICONDUCTOR CO LTD | |
Package Description | , SIP30 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.02 | |
Access Time-Max | 100 ns | |
I/O Type | COMMON | |
JESD-609 Code | e0 | |
Memory Density | 37748736 bit | |
Memory IC Type | FAST PAGE DRAM MODULE | |
Memory Width | 9 | |
Number of Terminals | 30 | |
Number of Words | 4194304 words | |
Number of Words Code | 4000000 | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 4MX9 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Equivalence Code | SIP30 | |
Qualification Status | Not Qualified | |
Refresh Cycles | 1024 | |
Seated Height-Max | 27.94 mm | |
Standby Current-Max | 0.009 A | |
Supply Current-Max | 0.72 mA | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | Tin/Lead (Sn/Pb) | |
Terminal Position | SINGLE |