Part Details for MSC23108B-10DS2 by LAPIS Semiconductor Co Ltd
Overview of MSC23108B-10DS2 by LAPIS Semiconductor Co Ltd
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Part Details for MSC23108B-10DS2
MSC23108B-10DS2 CAD Models
MSC23108B-10DS2 Part Data Attributes
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MSC23108B-10DS2
LAPIS Semiconductor Co Ltd
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MSC23108B-10DS2
LAPIS Semiconductor Co Ltd
Fast Page DRAM Module, 1MX8, 100ns, CMOS, PSMA30,
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| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | LAPIS SEMICONDUCTOR CO LTD | |
| Package Description | SIMM, SIM30 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.02 | |
| Access Time-Max | 100 ns | |
| I/O Type | COMMON | |
| JESD-30 Code | R-PSMA-N30 | |
| Memory Density | 8388608 bit | |
| Memory IC Type | FAST PAGE DRAM MODULE | |
| Memory Width | 8 | |
| Number of Terminals | 30 | |
| Number of Words | 1048576 words | |
| Number of Words Code | 1000000 | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 1MX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | SIMM | |
| Package Equivalence Code | SIM30 | |
| Package Shape | RECTANGULAR | |
| Package Style | MICROELECTRONIC ASSEMBLY | |
| Qualification Status | Not Qualified | |
| Refresh Cycles | 1024 | |
| Seated Height-Max | 16.51 mm | |
| Standby Current-Max | 0.002 A | |
| Supply Current-Max | 0.14 mA | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | SINGLE |