Datasheets
MRD300 by:
Motorola Semiconductor Products
Freescale Semiconductor
Matsuo Electric Co Ltd
Motorola Mobility LLC
Motorola Semiconductor Products
Not Found

Photo Transistor

Part Details for MRD300 by Motorola Semiconductor Products

Results Overview of MRD300 by Motorola Semiconductor Products

Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.

Applications Space Technology Aerospace and Defense Energy and Power Systems

MRD300 Information

MRD300 by Motorola Semiconductor Products is a Photo Transistor.
Photo Transistors are under the broader part category of Optoelectronics.

Optoelectronic components work to detect, generate, and control light. They can essentially produce and/or react to light. Read more about Optoelectronics on our Optoelectronics part category page.

Price & Stock for MRD300

Part # Distributor Description Stock Price Buy
ComSIT USA Electronic Component RoHS: Not Compliant Stock DE - 0
Stock ES - 5
Stock US - 0
Stock MX - 0
Stock CN - 0
Stock HK - 0
RFQ

Part Details for MRD300

MRD300 CAD Models

There are no models available for this part yet.

Sign in to request this CAD model.

Register or Sign In

MRD300 Part Data Attributes

MRD300 Motorola Semiconductor Products
Buy Now Datasheet
Compare Parts:
MRD300 Motorola Semiconductor Products Photo Transistor
Select a part to compare:
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer MOTOROLA INC
Reach Compliance Code unknown
ECCN Code 3A001.A.2.C
Additional Feature RESPONDS FROM VISIBLE TO INFRA RED RANGE
Coll-Emtr Bkdn Voltage-Min 50 V
Configuration SINGLE
Dark Current-Max 25 nA
JESD-609 Code e0
Light Current-Nom 7 mA
Mounting Feature THROUGH HOLE MOUNT
Number of Functions 1
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Optoelectronic Device Type PHOTO TRANSISTOR
Power Dissipation-Max 0.25 W
Response Time-Max 0.0000025 s
Shape ROUND
Size 3.68 mm
Surface Mount NO
Terminal Finish Tin/Lead (Sn/Pb)

Alternate Parts for MRD300

This table gives cross-reference parts and alternative options found for MRD300. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MRD300, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
OP803SLTXV TT Electronics OPTEK Technology Check for Price Photo Transistor MRD300 vs OP803SLTXV
L14G1 Harris Semiconductor Check for Price Photo Transistor, 0.05A I(C) MRD300 vs L14G1
L14G1 Intersil Corporation Check for Price PHOTOTRANSISTOR,NPN,50M,CAN-4.7 MRD300 vs L14G1
L14G1 QT Optoelectronics Check for Price Photo Transistor, 0.05A I(C), HERMETIC, TO-18, 3 PIN MRD300 vs L14G1
OP803SL TT Electronics OPTEK Technology Check for Price Photo Transistor, 930nm, 0.05A I(C), HERMETIC SEALED, TO-18, 3 PIN MRD300 vs OP803SL

MRD300 Frequently Asked Questions (FAQ)

  • The recommended operating temperature range for the MRD300 is -40°C to +125°C, although it can withstand storage temperatures from -55°C to +150°C.

  • To ensure proper biasing, connect the VCC pin to a stable 5V power supply, and the VEE pin to a stable -5V power supply. Additionally, decouple the power supply lines with 0.1uF capacitors to reduce noise and ensure stable operation.

  • The maximum allowable power dissipation for the MRD300 is 1.5W. Exceeding this limit can cause the device to overheat, leading to reduced performance or even damage.

  • To protect the MRD300 from ESD, handle the device by the body or pins, avoid touching the pins, and use an anti-static wrist strap or mat. Also, ensure that the device is stored in an anti-static bag or container.

  • For optimal performance, keep the MRD300 away from high-frequency signals and power supply lines. Use a ground plane under the device, and maintain a minimum spacing of 0.5mm between the device and other components.