Part Details for MPC862PVR66B by Freescale Semiconductor
Overview of MPC862PVR66B by Freescale Semiconductor
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for MPC862PVR66B
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
2156-MPC862PVR66B-ND
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DigiKey | IC MPU MPC8XX 66MHZ 357BGA Min Qty: 3 Lead time: 1 Weeks Container: Bulk MARKETPLACE PRODUCT |
56 In Stock |
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$115.9000 | Buy Now |
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Rochester Electronics | MPC862 - PowerQUICC RISC Microprocessor RoHS: Compliant Status: Obsolete Min Qty: 1 | 56 |
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$94.7200 / $111.4400 | Buy Now |
Part Details for MPC862PVR66B
MPC862PVR66B CAD Models
MPC862PVR66B Part Data Attributes
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MPC862PVR66B
Freescale Semiconductor
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Datasheet
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MPC862PVR66B
Freescale Semiconductor
PowerQUICC, 32 Bit Power Architecture, 66MHz, Communications Processor, 0 to 105C
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | FREESCALE SEMICONDUCTOR INC | |
Package Description | BGA-357 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.A.2 | |
HTS Code | 8542.31.00.01 | |
Address Bus Width | 32 | |
Bit Size | 32 | |
Boundary Scan | YES | |
External Data Bus Width | 32 | |
Format | FIXED POINT | |
Integrated Cache | YES | |
JESD-30 Code | S-PBGA-B357 | |
JESD-609 Code | e1 | |
Length | 25 mm | |
Low Power Mode | YES | |
Moisture Sensitivity Level | 3 | |
Number of Terminals | 357 | |
Operating Temperature-Max | 105 °C | |
Operating Temperature-Min | ||
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Peak Reflow Temperature (Cel) | 245 | |
Seated Height-Max | 2.52 mm | |
Speed | 66 MHz | |
Supply Voltage-Max | 3.465 V | |
Supply Voltage-Min | 3.135 V | |
Supply Voltage-Nom | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | OTHER | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 25 mm | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |