Part Details for MPC860DPZQ66D4 by Freescale Semiconductor
Overview of MPC860DPZQ66D4 by Freescale Semiconductor
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Computing and Data Storage
Price & Stock for MPC860DPZQ66D4
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
2156-MPC860DPZQ66D4-ND
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DigiKey | IC MPU MPC86XX 66MHZ 357BGA Min Qty: 3 Lead time: 1 Weeks Container: Bulk MARKETPLACE PRODUCT |
132 In Stock |
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$146.3800 | Buy Now |
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Bristol Electronics | 3 |
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RFQ | ||
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Quest Components | 2 |
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$167.0746 / $175.8680 | Buy Now | |
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Rochester Electronics | MPC860DP - PowerQUICC, 32 Bit Power Architecture SoC, 66MHz, 0 to 95C RoHS: Not Compliant Status: Rochester Active Min Qty: 1 | 132 |
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$125.6200 / $147.7800 | Buy Now |
Part Details for MPC860DPZQ66D4
MPC860DPZQ66D4 CAD Models
MPC860DPZQ66D4 Part Data Attributes:
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MPC860DPZQ66D4
Freescale Semiconductor
Buy Now
Datasheet
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Compare Parts:
MPC860DPZQ66D4
Freescale Semiconductor
PowerQUICC, 32 Bit Power Architecture SoC, 66MHz, CPM, ENET, ATM, HDLC, PCMCIA, 0 to 95C
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | FREESCALE SEMICONDUCTOR INC | |
| Part Package Code | BGA | |
| Package Description | 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 | |
| Pin Count | 357 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Samacsys Manufacturer | NXP | |
| Address Bus Width | 32 | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| Clock Frequency-Max | 50 MHz | |
| External Data Bus Width | 32 | |
| Format | FIXED POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-PBGA-B357 | |
| JESD-609 Code | e0 | |
| Length | 25 mm | |
| Low Power Mode | YES | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 357 | |
| Operating Temperature-Min | ||
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA357,19X19,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 245 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.52 mm | |
| Speed | 66 MHz | |
| Supply Voltage-Max | 3.465 V | |
| Supply Voltage-Min | 3.135 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 25 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
Alternate Parts for MPC860DPZQ66D4
This table gives cross-reference parts and alternative options found for MPC860DPZQ66D4. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MPC860DPZQ66D4, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| MPC860DTZQ66D4 | 32-BIT, 66MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 | Freescale Semiconductor | MPC860DPZQ66D4 vs MPC860DTZQ66D4 |
| MPC860TVR66D4 | PowerQUICC, 32 Bit Power Architecture, 6MHz, Communications Processor, 0 to 95C | Freescale Semiconductor | MPC860DPZQ66D4 vs MPC860TVR66D4 |
| MPC860ENZQ66D4 | PowerQUICC, 32 Bit Power Architecture SoC, 66MHz, CPM, ENET, PCMCIA, 0 to 95C | Freescale Semiconductor | MPC860DPZQ66D4 vs MPC860ENZQ66D4 |
| MPC860DEVR66D4 | PowerQUICC, 32 Bit Power Architecture SoC, 66MHz, CPM, ENET, HDLC, PCMCIA, 0 to 95C | Freescale Semiconductor | MPC860DPZQ66D4 vs MPC860DEVR66D4 |
| MPC860SRCZQ66D4 | PowerQUICC, 32 Bit Power Architecture, 66MHz, Communications Processor, -40 to 95C | Freescale Semiconductor | MPC860DPZQ66D4 vs MPC860SRCZQ66D4 |
| MPC860TCVR66D4 | PowerQUICC, 32 Bit Power Architecture, 66MHz, Communications Processor, -40 to 95C | Freescale Semiconductor | MPC860DPZQ66D4 vs MPC860TCVR66D4 |
| MPC860SRVR66D4 | PowerQUICC, 32 Bit Power Architecture, 66MHz, Communications Processor, 0 to 95C | Freescale Semiconductor | MPC860DPZQ66D4 vs MPC860SRVR66D4 |
| MPC855TZQ66D4 | PowerQUICC, 32 Bit Power Architecture SoC, 66MHz, CPM, ENET, ATM, HDLC, PCMCIA, 0 to 95C | Freescale Semiconductor | MPC860DPZQ66D4 vs MPC855TZQ66D4 |
| MPC855TCVR66D4 | PowerQUICC, 32 Bit Power Architecture SoC, 66MHz, CPM, ENET, ATM, HDLC, PCMCIA, -40 to 95C | Freescale Semiconductor | MPC860DPZQ66D4 vs MPC855TCVR66D4 |
| MPC860TZQ66D4 | 32-BIT, 66MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 | Freescale Semiconductor | MPC860DPZQ66D4 vs MPC860TZQ66D4 |