Part Details for MPC860DEZQ66D4 by Freescale Semiconductor
Overview of MPC860DEZQ66D4 by Freescale Semiconductor
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Computing and Data Storage
Part Details for MPC860DEZQ66D4
MPC860DEZQ66D4 CAD Models
MPC860DEZQ66D4 Part Data Attributes
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MPC860DEZQ66D4
Freescale Semiconductor
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Datasheet
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MPC860DEZQ66D4
Freescale Semiconductor
PowerQUICC, 32 Bit Power Architecture SoC, 66MHz, CPM, ENET, HDLC, PCMCIA, 0 to 95C
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| parentfamilyid | 1604409 | |
| Ihs Manufacturer | FREESCALE SEMICONDUCTOR INC | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA357,19X19,50 | |
| Pin Count | 357 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Total Weight | 2173.7 | |
| Category CO2 Kg | 12.2 | |
| CO2 | 26519.139999999996 | |
| Candidate List Date | 2024-01-23 | |
| SVHC Over MCV | 7439-92-1 | |
| CAS Accounted for Wt | 84 | |
| CA Prop 65 Presence | YES | |
| CA Prop 65 CAS Numbers | 7440-38-2, 7440-43-9, 1333-86-4, 7439-92-1, 7440-02-0 | |
| EFUP | 50 | |
| Conflict Mineral Status | DRC Conflict Free Undeterminable | |
| Conflict Mineral Status Source | CMRT V3.01 | |
| Address Bus Width | 32 | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| Clock Frequency-Max | 50 MHz | |
| External Data Bus Width | 32 | |
| Format | FIXED POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-PBGA-B357 | |
| JESD-609 Code | e0 | |
| Length | 25 mm | |
| Low Power Mode | YES | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 357 | |
| Operating Temperature-Min | ||
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA357,19X19,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 245 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.52 mm | |
| Speed | 66 MHz | |
| Supply Voltage-Max | 3.465 V | |
| Supply Voltage-Min | 3.135 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 25 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
Alternate Parts for MPC860DEZQ66D4
This table gives cross-reference parts and alternative options found for MPC860DEZQ66D4. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MPC860DEZQ66D4, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| MPC860ENCVR66D4 | 32-BIT, 66MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, LEAD FREE, PLASTIC, BGA-357 | Freescale Semiconductor | MPC860DEZQ66D4 vs MPC860ENCVR66D4 |
| MPC860PZQ66D4 | PowerQUICC, 32 Bit Power Architecture SoC, 66MHz, CPM, ENET, ATM, HDLC, PCMCIA, 0 to 95C | Freescale Semiconductor | MPC860DEZQ66D4 vs MPC860PZQ66D4 |
| MPC860SRZQ66D4R2 | 32-BIT, 66MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 | Freescale Semiconductor | MPC860DEZQ66D4 vs MPC860SRZQ66D4R2 |
| MPC860DEVR66D4 | PowerQUICC, 32 Bit Power Architecture SoC, 66MHz, CPM, ENET, HDLC, PCMCIA, 0 to 95C | Freescale Semiconductor | MPC860DEZQ66D4 vs MPC860DEVR66D4 |
| MPC860TVR66D4 | PowerQUICC, 32 Bit Power Architecture, 6MHz, Communications Processor, 0 to 95C | Freescale Semiconductor | MPC860DEZQ66D4 vs MPC860TVR66D4 |
| MPC860SRCVR66D4 | 32-BIT, 66MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, LEAD FREE, PLASTIC, BGA-357 | Freescale Semiconductor | MPC860DEZQ66D4 vs MPC860SRCVR66D4 |
| MPC860PZQ66D4R2 | 32-BIT, 66MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 | Freescale Semiconductor | MPC860DEZQ66D4 vs MPC860PZQ66D4R2 |
| MPC860PCZQ66D4 | PowerQUICC, 32 Bit Power Architecture SoC, 66MHz, CPM, ENET, ATM, HDLC, PCMCIA, -40 to 95C | Freescale Semiconductor | MPC860DEZQ66D4 vs MPC860PCZQ66D4 |
| MPC860TCVR66D4 | PowerQUICC, 32 Bit Power Architecture, 66MHz, Communications Processor, -40 to 95C | Freescale Semiconductor | MPC860DEZQ66D4 vs MPC860TCVR66D4 |
| MPC860DPZQ66D4 | PowerQUICC, 32 Bit Power Architecture SoC, 66MHz, CPM, ENET, ATM, HDLC, PCMCIA, 0 to 95C | Freescale Semiconductor | MPC860DEZQ66D4 vs MPC860DPZQ66D4 |