Part Details for MPC8548VTAUJD by NXP Semiconductors
Overview of MPC8548VTAUJD by NXP Semiconductors
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Industrial Automation
Renewable Energy
Robotics and Drones
Price & Stock for MPC8548VTAUJD
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
MPC8548VTAUJD
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Avnet Americas | MPU MPC85xx RISC 32-Bit 0.09um 1.333GHz 1.8V/2.5V/3.3V 783-Pin FC-BGA Tray - Trays (Alt: MPC8548VTAUJD) RoHS: Compliant Min Qty: 4 Package Multiple: 1 Lead time: 0 Weeks, 2 Days Container: Tray | 50 Partner Stock |
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RFQ | |
DISTI #
26648362
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Verical | MPU PowerQUICC III RISC 32bit 0.09um 1.333GHz 1.8V/2.5V/3.3V 783-Pin FCBGA Tray Min Qty: 1 Package Multiple: 1 Date Code: 1434 | Americas - 244 |
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$158.7100 | Buy Now |
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Flip Electronics | Stock, ship today | 50 |
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RFQ |
Part Details for MPC8548VTAUJD
MPC8548VTAUJD CAD Models
MPC8548VTAUJD Part Data Attributes
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MPC8548VTAUJD
NXP Semiconductors
Buy Now
Datasheet
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Compare Parts:
MPC8548VTAUJD
NXP Semiconductors
MICROPROCESSOR
|
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Package Description | BGA-783 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A991.A.2 | |
HTS Code | 8542.31.00.01 | |
Factory Lead Time | 2 Days | |
Samacsys Manufacturer | NXP | |
JESD-30 Code | S-PBGA-B783 | |
JESD-609 Code | e2 | |
Length | 29 mm | |
Moisture Sensitivity Level | 3 | |
Number of Terminals | 783 | |
Operating Temperature-Max | 105 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA783,28X28,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Peak Reflow Temperature (Cel) | 260 | |
Seated Height-Max | 3.38 mm | |
Supply Voltage-Max | 1.155 V | |
Supply Voltage-Min | 1.045 V | |
Supply Voltage-Nom | 1.1 V | |
Surface Mount | YES | |
Technology | CMOS | |
Terminal Finish | Tin/Silver (Sn/Ag) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Width | 29 mm | |
uPs/uCs/Peripheral ICs Type | SoC |