Part Details for MPC8548PXATGD by Freescale Semiconductor
Overview of MPC8548PXATGD by Freescale Semiconductor
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Industrial Automation
Renewable Energy
Robotics and Drones
Price & Stock for MPC8548PXATGD
Part # | Distributor | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
|
Rochester Electronics | MPC8548 - PowerQuicc III Integrated Processor RoHS: Not Compliant Status: Obsolete Min Qty: 1 | 792 |
|
$141.7300 / $166.7400 | Buy Now |
Part Details for MPC8548PXATGD
MPC8548PXATGD CAD Models
MPC8548PXATGD Part Data Attributes
|
MPC8548PXATGD
Freescale Semiconductor
Buy Now
Datasheet
|
Compare Parts:
MPC8548PXATGD
Freescale Semiconductor
PowerQUICC 32-Bit Power Arch SoC, 1200MHz, GbE, PCI, PCI-X, PCIe, SRIO, DDR2, ECC, 0 to 105C, R3
|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | FREESCALE SEMICONDUCTOR INC | |
Package Description | FCBGA-783 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A991.A.2 | |
HTS Code | 8542.31.00.01 | |
JESD-30 Code | S-PBGA-B783 | |
JESD-609 Code | e0 | |
Length | 29 mm | |
Moisture Sensitivity Level | 3 | |
Number of Terminals | 783 | |
Operating Temperature-Max | 105 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA783,28X28,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 3.38 mm | |
Supply Voltage-Max | 1.155 V | |
Supply Voltage-Min | 1.045 V | |
Supply Voltage-Nom | 1.1 V | |
Surface Mount | YES | |
Technology | CMOS | |
Terminal Finish | Tin/Lead/Silver (Sn/Pb/Ag) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Width | 29 mm | |
uPs/uCs/Peripheral ICs Type | SoC |