There are no models available for this part yet.
Overview of MPC8272ZQPIEA by Freescale Semiconductor
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Industrial Automation
Renewable Energy
Robotics and Drones
CAD Models for MPC8272ZQPIEA by Freescale Semiconductor
Part Data Attributes for MPC8272ZQPIEA by Freescale Semiconductor
|
|
---|---|
Pbfree Code
|
No
|
Rohs Code
|
No
|
Part Life Cycle Code
|
Obsolete
|
Ihs Manufacturer
|
FREESCALE SEMICONDUCTOR INC
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Reach Compliance Code
|
not_compliant
|
JESD-30 Code
|
S-PBGA-B516
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JESD-609 Code
|
e0
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Moisture Sensitivity Level
|
3
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Number of Terminals
|
516
|
Operating Temperature-Max
|
70 °C
|
Operating Temperature-Min
|
|
Package Body Material
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PLASTIC/EPOXY
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Package Code
|
BGA
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Package Equivalence Code
|
BGA516,26X26,40
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Package Shape
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SQUARE
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Package Style
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GRID ARRAY
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Peak Reflow Temperature (Cel)
|
245
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Qualification Status
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Not Qualified
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Surface Mount
|
YES
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Technology
|
CMOS
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Temperature Grade
|
COMMERCIAL
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Terminal Finish
|
TIN LEAD SILVER
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Terminal Form
|
BALL
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Terminal Pitch
|
1 mm
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Terminal Position
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BOTTOM
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Time@Peak Reflow Temperature-Max (s)
|
30
|