Part Details for MPC8266AZUPJDC by NXP Semiconductors
Overview of MPC8266AZUPJDC by NXP Semiconductors
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Industrial Automation
Renewable Energy
Robotics and Drones
Price & Stock for MPC8266AZUPJDC
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
MPC8266AZUPJDC
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EBV Elektronik | MPU MPC82xx RISC 32-Bit 0.25um 300MHz 3.3V 480-Pin TBGA Tray (Alt: MPC8266AZUPJDC) RoHS: Not Compliant Min Qty: 21 Package Multiple: 21 Lead time: 27 Weeks, 0 Days | EBV - 0 |
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Part Details for MPC8266AZUPJDC
MPC8266AZUPJDC CAD Models
MPC8266AZUPJDC Part Data Attributes
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MPC8266AZUPJDC
NXP Semiconductors
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Datasheet
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MPC8266AZUPJDC
NXP Semiconductors
RISC PROCESSOR
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Package Description | 37.50 X 37.50 MM, 1.55 MM HEIGHT, 1.27 MM PITCH, TBGA-480 | |
Reach Compliance Code | unknown | |
HTS Code | 8542.31.00.01 | |
Address Bus Width | 32 | |
Bit Size | 32 | |
Boundary Scan | YES | |
External Data Bus Width | 64 | |
Format | FLOATING POINT | |
Integrated Cache | YES | |
JESD-30 Code | S-PBGA-B480 | |
JESD-609 Code | e0 | |
Length | 37.5 mm | |
Low Power Mode | NO | |
Moisture Sensitivity Level | 3 | |
Number of Terminals | 480 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE | |
Seated Height-Max | 1.65 mm | |
Surface Mount | YES | |
Technology | CMOS | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Width | 37.5 mm | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |