Datasheets
MPC7410RX500LE by:
Freescale Semiconductor
Freescale Semiconductor
Motorola Mobility LLC
Motorola Semiconductor Products
Not Found

32-BIT, 500MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360

Part Details for MPC7410RX500LE by Freescale Semiconductor

Results Overview of MPC7410RX500LE by Freescale Semiconductor

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MPC7410RX500LE Information

MPC7410RX500LE by Freescale Semiconductor is a Microprocessor.
Microprocessors are under the broader part category of Microcontrollers and Processors.

Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.

Price & Stock for MPC7410RX500LE

Part # Distributor Description Stock Price Buy
ComSIT USA RISC MICROPROCESSOR RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360 RoHS: Not Compliant ECCN: 3A001.A.3 Stock DE - 1
Stock ES - 9
Stock US - 0
Stock MX - 0
Stock CN - 0
Stock HK - 0
RFQ

Part Details for MPC7410RX500LE

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MPC7410RX500LE Part Data Attributes

MPC7410RX500LE Freescale Semiconductor
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MPC7410RX500LE Freescale Semiconductor 32-BIT, 500MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360
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Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC
Part Package Code BGA
Package Description 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360
Pin Count 360
Reach Compliance Code not_compliant
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Address Bus Width 32
Bit Size 32
Boundary Scan YES
Clock Frequency-Max 133 MHz
External Data Bus Width 64
Format FLOATING POINT
Integrated Cache YES
JESD-30 Code S-CBGA-B360
JESD-609 Code e0
Length 25 mm
Low Power Mode YES
Moisture Sensitivity Level 1
Number of Terminals 360
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code HBGA
Package Equivalence Code BGA360,19X19,50
Package Shape SQUARE
Package Style GRID ARRAY, HEAT SINK/SLUG
Peak Reflow Temperature (Cel) 245
Qualification Status Not Qualified
Seated Height-Max 3.2 mm
Speed 500 MHz
Supply Voltage-Max 1.9 V
Supply Voltage-Min 1.7 V
Supply Voltage-Nom 1.8 V
Surface Mount YES
Technology CMOS
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 25 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC

Alternate Parts for MPC7410RX500LE

This table gives cross-reference parts and alternative options found for MPC7410RX500LE. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MPC7410RX500LE, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
PC7410VGSU500LE Atmel Corporation Check for Price RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, 4.20 MM HEIGHT, COLUMN INTERPOSER, CERAMIC, BGA-360 MPC7410RX500LE vs PC7410VGSU500LE
MPC7410THX500LE Motorola Semiconductor Products Check for Price RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, FCBGA-360 MPC7410RX500LE vs MPC7410THX500LE
MPC7410RX500LE Motorola Semiconductor Products Check for Price RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 MPC7410RX500LE vs MPC7410RX500LE
PCX7410VGHU500LE Teledyne e2v Check for Price RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, HITCE, CERAMIC, BGA-360 MPC7410RX500LE vs PCX7410VGHU500LE
PC7410MG500LE Atmel Corporation Check for Price RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 MPC7410RX500LE vs PC7410MG500LE
MPC7410HX500LE NXP Semiconductors Check for Price 32-BIT, 500MHz, RISC PROCESSOR, CBGA360 MPC7410RX500LE vs MPC7410HX500LE
PCX7410VGSU500LE Atmel Corporation Check for Price RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, BGA-360 MPC7410RX500LE vs PCX7410VGSU500LE
PCX7410VGHU500LE Atmel Corporation Check for Price RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, HITCE, CERAMIC, BGA-360 MPC7410RX500LE vs PCX7410VGHU500LE
Part Number Manufacturer Composite Price Description Compare
PC7410MGU500LE Teledyne e2v Check for Price RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 MPC7410RX500LE vs PC7410MGU500LE
MPC7410THX500LE NXP Semiconductors Check for Price 32-BIT, 500MHz, RISC PROCESSOR, CBGA360 MPC7410RX500LE vs MPC7410THX500LE
MPC7410HX500LE Motorola Mobility LLC Check for Price 32-BIT, 500 MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 MPC7410RX500LE vs MPC7410HX500LE
PC7410VGS500NE Teledyne e2v Check for Price RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, 4.20 MM HEIGHT, COLUMN INTERPOSER, CERAMIC, BGA-360 MPC7410RX500LE vs PC7410VGS500NE
PC7410VGHU500NE Teledyne e2v Check for Price RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-360 MPC7410RX500LE vs PC7410VGHU500NE
MPC7410RX500LX Motorola Semiconductor Products Check for Price RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 MPC7410RX500LE vs MPC7410RX500LX
MPC7410VS500LE NXP Semiconductors Check for Price 32-BIT, 500MHz, RISC PROCESSOR, CLGA360 MPC7410RX500LE vs MPC7410VS500LE
PCX7410MGSU500NE Microchip Technology Inc Check for Price RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360 MPC7410RX500LE vs PCX7410MGSU500NE
PC7410VG500LE Atmel Corporation Check for Price RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 MPC7410RX500LE vs PC7410VG500LE
PCX7410MGU500LE Teledyne e2v Check for Price RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, CERAMIC, BGA-360 MPC7410RX500LE vs PCX7410MGU500LE

MPC7410RX500LE Related Parts

MPC7410RX500LE Frequently Asked Questions (FAQ)

  • The maximum operating temperature range for the MPC7410RX500LE is -40°C to 105°C.

  • The clock settings for the MPC7410RX500LE can be configured using the Clock Generation Module (CGM) and the System Integration Module (SIM). The CGM generates the clock signals, while the SIM controls the clock distribution and selection.

  • The maximum frequency of the e300 core in the MPC7410RX500LE is 500 MHz.

  • The MPC7410RX500LE has 512 KB of flash memory.

  • Yes, the MPC7410RX500LE is designed to operate in harsh environments and has features such as error correction code (ECC) and parity checking to ensure data integrity.