Datasheets
MPC7410HX450LE by:
NXP Semiconductors
Freescale Semiconductor
Motorola Mobility LLC
Motorola Semiconductor Products
NXP Semiconductors
Not Found

32-BIT, 450MHz, RISC PROCESSOR, CBGA360

Part Details for MPC7410HX450LE by NXP Semiconductors

Results Overview of MPC7410HX450LE by NXP Semiconductors

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MPC7410HX450LE Information

MPC7410HX450LE by NXP Semiconductors is a Microprocessor.
Microprocessors are under the broader part category of Microcontrollers and Processors.

Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.

Price & Stock for MPC7410HX450LE

Part # Distributor Description Stock Price Buy
DISTI # MPC7410HX450LE
EBV Elektronik MPU MPC74xx RISC 64Bit 018um 450MHz 18V25V33V 360Pin FCCBGA Tray (Alt: MPC7410HX450LE) RoHS: Not Compliant Min Qty: 44 Package Multiple: 44 EBV - 0
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Flip Electronics Stock 43
RFQ

Part Details for MPC7410HX450LE

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MPC7410HX450LE Part Data Attributes

MPC7410HX450LE NXP Semiconductors
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MPC7410HX450LE NXP Semiconductors 32-BIT, 450MHz, RISC PROCESSOR, CBGA360
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Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS
Package Description 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, HCTE, CERAMIC, BGA-360
Reach Compliance Code unknown
ECCN Code 3A991.A.1
HTS Code 8542.31.00.01
Samacsys Manufacturer NXP
Address Bus Width 32
Bit Size 32
Boundary Scan YES
Clock Frequency-Max 133 MHz
External Data Bus Width 64
Format FLOATING POINT
Integrated Cache YES
JESD-30 Code S-CBGA-B360
JESD-609 Code e0
Length 25 mm
Low Power Mode YES
Moisture Sensitivity Level 1
Number of Terminals 360
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code HBGA
Package Shape SQUARE
Package Style GRID ARRAY, HEAT SINK/SLUG
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Seated Height-Max 3.2 mm
Speed 450 MHz
Supply Voltage-Max 1.9 V
Supply Voltage-Min 1.7 V
Supply Voltage-Nom 1.8 V
Surface Mount YES
Technology CMOS
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 40
Width 25 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC

Alternate Parts for MPC7410HX450LE

This table gives cross-reference parts and alternative options found for MPC7410HX450LE. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MPC7410HX450LE, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
PCX7410MGHU450LE Teledyne e2v Check for Price RISC Microprocessor, 32-Bit, 450MHz, CMOS, CBGA360, HITCE, CERAMIC, BGA-360 MPC7410HX450LE vs PCX7410MGHU450LE
PCX7410VGHU450LE Atmel Corporation Check for Price RISC Microprocessor, 32-Bit, 450MHz, CMOS, CBGA360, HITCE, CERAMIC, BGA-360 MPC7410HX450LE vs PCX7410VGHU450LE
PC7410VGS450LE Teledyne e2v Check for Price RISC Microprocessor, 32-Bit, 450MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, 4.20 MM HEIGHT, COLUMN INTERPOSER, CERAMIC, BGA-360 MPC7410HX450LE vs PC7410VGS450LE
PCX7410MGHU450LE Atmel Corporation Check for Price RISC Microprocessor, 32-Bit, 450MHz, CMOS, CBGA360, HITCE, CERAMIC, BGA-360 MPC7410HX450LE vs PCX7410MGHU450LE
PCX7410VGHU450LE Teledyne e2v Check for Price RISC Microprocessor, 32-Bit, 450MHz, CMOS, CBGA360, HITCE, CERAMIC, BGA-360 MPC7410HX450LE vs PCX7410VGHU450LE
MPC7410TRX450NE Motorola Mobility LLC Check for Price 32-BIT, 450MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 MPC7410HX450LE vs MPC7410TRX450NE
MPC7410RX450NE Freescale Semiconductor Check for Price 32-BIT, 450MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 MPC7410HX450LE vs MPC7410RX450NE
PC7410VG450LE Atmel Corporation Check for Price RISC Microprocessor, 32-Bit, 450MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 MPC7410HX450LE vs PC7410VG450LE
Part Number Manufacturer Composite Price Description Compare
MPC7410TRX450LE Freescale Semiconductor Check for Price IC,MICROPROCESSOR,32-BIT,CMOS,BGA,360PIN,CERAMIC MPC7410HX450LE vs MPC7410TRX450LE
PC7410MG450LE Teledyne e2v Check for Price RISC Microprocessor, 32-Bit, 450MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 MPC7410HX450LE vs PC7410MG450LE
PCX7410VGSU450LE Teledyne e2v Check for Price RISC Microprocessor, 32-Bit, 450MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, BGA-360 MPC7410HX450LE vs PCX7410VGSU450LE
MPC7410RX450LE Freescale Semiconductor Check for Price 32-BIT, 450MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 MPC7410HX450LE vs MPC7410RX450LE
PC7410VGHU450LE Teledyne e2v Check for Price RISC Microprocessor, 32-Bit, 450MHz, CMOS, CBGA360, 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-360 MPC7410HX450LE vs PC7410VGHU450LE
MPC7410RX450NE Motorola Mobility LLC Check for Price 32-BIT, 450 MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 MPC7410HX450LE vs MPC7410RX450NE
MPC7410RX450PER2 Motorola Semiconductor Products Check for Price RISC Microprocessor, 32-Bit, 450MHz, CMOS, CBGA360, CERAMIC, BGA-360 MPC7410HX450LE vs MPC7410RX450PER2
MPC7410RX450NE Motorola Semiconductor Products Check for Price RISC Microprocessor, 32-Bit, 450MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 MPC7410HX450LE vs MPC7410RX450NE
MPC7410RX450LD Motorola Mobility LLC Check for Price 32-BIT, 450MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 MPC7410HX450LE vs MPC7410RX450LD
PCX7410MGU450LE Teledyne e2v Check for Price RISC Microprocessor, 32-Bit, 450MHz, CMOS, CBGA360, CERAMIC, BGA-360 MPC7410HX450LE vs PCX7410MGU450LE

MPC7410HX450LE Related Parts

MPC7410HX450LE Frequently Asked Questions (FAQ)

  • The maximum operating temperature range for the MPC7410HX450LE is -40°C to 105°C.

  • The clock settings for the MPC7410HX450LE can be configured using the Clock Generation Module (CGM) and the Phase-Locked Loop (PLL) module. Refer to the device's reference manual for detailed configuration instructions.

  • The maximum frequency for the external bus interface (EBI) of the MPC7410HX450LE is 133 MHz.

  • The MPC7410HX450LE has a built-in Power Management Module (PMM) that allows for dynamic voltage and frequency scaling. The PMM can be configured to reduce power consumption during idle periods or when the system is in a low-power state.

  • The MPC7410HX450LE has a maximum flash memory capacity of 450 KB.