Part Details for MPC7410HX450LE by NXP Semiconductors
Overview of MPC7410HX450LE by NXP Semiconductors
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for MPC7410HX450LE
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
|
|
Flip Electronics | Stock | 43 |
|
RFQ |
Part Details for MPC7410HX450LE
MPC7410HX450LE CAD Models
MPC7410HX450LE Part Data Attributes
|
|
MPC7410HX450LE
NXP Semiconductors
Buy Now
Datasheet
|
Compare Parts:
MPC7410HX450LE
NXP Semiconductors
32-BIT, 450MHz, RISC PROCESSOR, CBGA360
|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, HCTE, CERAMIC, BGA-360 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.A.1 | |
| HTS Code | 8542.31.00.01 | |
| Samacsys Manufacturer | NXP | |
| Address Bus Width | 32 | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| Clock Frequency-Max | 133 MHz | |
| External Data Bus Width | 64 | |
| Format | FLOATING POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-CBGA-B360 | |
| JESD-609 Code | e0 | |
| Length | 25 mm | |
| Low Power Mode | YES | |
| Moisture Sensitivity Level | 1 | |
| Number of Terminals | 360 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | HBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 3.2 mm | |
| Speed | 450 MHz | |
| Supply Voltage-Max | 1.9 V | |
| Supply Voltage-Min | 1.7 V | |
| Supply Voltage-Nom | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 25 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
Alternate Parts for MPC7410HX450LE
This table gives cross-reference parts and alternative options found for MPC7410HX450LE. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MPC7410HX450LE, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| PCX7410VGSU450LE | RISC Microprocessor, 32-Bit, 450MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, BGA-360 | Teledyne e2v | MPC7410HX450LE vs PCX7410VGSU450LE |
| PC7410VGS450LE | RISC Microprocessor, 32-Bit, 450MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, 4.20 MM HEIGHT, COLUMN INTERPOSER, CERAMIC, BGA-360 | Teledyne e2v | MPC7410HX450LE vs PC7410VGS450LE |
| PCX7410MGHU450LE | RISC Microprocessor, 32-Bit, 450MHz, CMOS, CBGA360, HITCE, CERAMIC, BGA-360 | Teledyne e2v | MPC7410HX450LE vs PCX7410MGHU450LE |
| PC7410MGS450LE | RISC Microprocessor, 32-Bit, 450MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, 4.20 MM HEIGHT, COLUMN INTERPOSER, CERAMIC, BGA-360 | Atmel Corporation | MPC7410HX450LE vs PC7410MGS450LE |
| PC7410VG450LE | RISC Microprocessor, 32-Bit, 450MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 | Atmel Corporation | MPC7410HX450LE vs PC7410VG450LE |
| MPC7410HX450LE | NT HITCE RV1.4,1.8V,105C | Freescale Semiconductor | MPC7410HX450LE vs MPC7410HX450LE |
| MPC7410RX450NE | 32-BIT, 450 MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 | Motorola Mobility LLC | MPC7410HX450LE vs MPC7410RX450NE |
| PC7410VGHU450LE | RISC Microprocessor, 32-Bit, 450MHz, CMOS, CBGA360, 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-360 | Teledyne e2v | MPC7410HX450LE vs PC7410VGHU450LE |
| MPC7410THX450LE | 32-BIT, 450MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, FCBGA-360 | Freescale Semiconductor | MPC7410HX450LE vs MPC7410THX450LE |
| MPC7410RX450LD | 32-BIT, 450MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 | Motorola Mobility LLC | MPC7410HX450LE vs MPC7410RX450LD |