Part Details for MPC5554MZP112 by NXP Semiconductors
Overview of MPC5554MZP112 by NXP Semiconductors
- Distributor Offerings: (8 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Internet of Things (IoT)
Environmental Monitoring
Industrial Automation
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Automotive
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Renewable Energy
Entertainment and Gaming
Robotics and Drones
Price & Stock for MPC5554MZP112
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
11AC3567
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Newark | Nxp 32-Bit Mcu, Power Arch Core, 2Mb Flash, 112Mhz, -40/+125Degc, Automotive Grade, Pbga 416/ Tray Rohs Compliant: Yes |Nxp MPC5554MZP112 Min Qty: 200 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$59.6100 | Buy Now |
DISTI #
MPC5554MZP112-ND
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DigiKey | IC MCU 32BIT 2MB FLASH 416PBGA Min Qty: 200 Lead time: 16 Weeks Container: Tray | Limited Supply - Call |
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$64.3370 | Buy Now |
DISTI #
MPC5554MZP112
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Avnet Americas | MCU 32-bit MPC55xx e200 RISC 2048KB Flash 1.8V/2.5V/3.3V/5V 416-Pin BGA Tray - Trays (Alt: MPC5554MZP112) RoHS: Not Compliant Min Qty: 200 Package Multiple: 200 Lead time: 16 Weeks, 0 Days Container: Tray | 0 |
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$56.4200 / $65.0650 | Buy Now |
DISTI #
841-MPC5554MZP112
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Mouser Electronics | 32-bit Microcontrollers - MCU NXP 32-bit MCU, Power Arch core, 2MB Flash, 112MHz, -40/+125degC, Automotive Grade, PBGA 416 | 0 |
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Order Now | |
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Rochester Electronics | Microcontroller, 32-Bit, FLASH, 112MHz, CMOS, PBGA416 RoHS: Not Compliant Status: Not Recommended for New Designs Min Qty: 1 | 40 |
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$62.0400 / $72.9900 | Buy Now |
DISTI #
MPC5554MZP112
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Avnet Silica | MCU 32-bit MPC55xx e200 RISC 2048KB Flash 1.8V/2.5V/3.3V/5V 416-Pin BGA Tray (Alt: MPC5554MZP112) RoHS: Not Compliant Min Qty: 40 Package Multiple: 40 Lead time: 18 Weeks, 0 Days | Silica - 0 |
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Buy Now | |
DISTI #
MPC5554MZP112
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EBV Elektronik | MCU 32-bit MPC55xx e200 RISC 2048KB Flash 1.8V/2.5V/3.3V/5V 416-Pin BGA Tray (Alt: MPC5554MZP112) RoHS: Not Compliant Min Qty: 40 Package Multiple: 40 Lead time: 18 Weeks, 0 Days | EBV - 0 |
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Buy Now | |
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Flip Electronics | Stock | 196 |
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RFQ |
Part Details for MPC5554MZP112
MPC5554MZP112 CAD Models
MPC5554MZP112 Part Data Attributes:
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MPC5554MZP112
NXP Semiconductors
Buy Now
Datasheet
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Compare Parts:
MPC5554MZP112
NXP Semiconductors
32-BIT, FLASH, 112MHz, MICROCONTROLLER, PBGA416
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Rohs Code | No | |
Part Life Cycle Code | Not Recommended | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Package Description | TEPBGA-416 | |
Reach Compliance Code | unknown | |
ECCN Code | 3A991.A.2 | |
HTS Code | 8542.31.00.01 | |
Factory Lead Time | 16 Weeks | |
Samacsys Manufacturer | NXP | |
Has ADC | YES | |
Additional Feature | IT ALSO REQUIRES 3.3V SUPPLY | |
Address Bus Width | 24 | |
Bit Size | 32 | |
Clock Frequency-Max | 20 MHz | |
DAC Channels | NO | |
DMA Channels | NO | |
External Data Bus Width | 32 | |
JESD-30 Code | S-PBGA-B416 | |
JESD-609 Code | e0 | |
Length | 27 mm | |
Moisture Sensitivity Level | 3 | |
Number of I/O Lines | 220 | |
Number of Terminals | 416 | |
On Chip Program ROM Width | 8 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -40 °C | |
PWM Channels | YES | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | HBGA | |
Package Equivalence Code | BGA416,26X26,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, HEAT SINK/SLUG | |
Peak Reflow Temperature (Cel) | 245 | |
Qualification Status | Not Qualified | |
RAM (bytes) | 65536 | |
ROM (words) | 2097152 | |
ROM Programmability | FLASH | |
Seated Height-Max | 2.55 mm | |
Speed | 112 MHz | |
Supply Current-Max | 600 mA | |
Supply Voltage-Max | 1.65 V | |
Supply Voltage-Min | 1.35 V | |
Supply Voltage-Nom | 1.5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | AUTOMOTIVE | |
Terminal Finish | Tin/Lead (Sn/Pb) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 27 mm | |
uPs/uCs/Peripheral ICs Type | MICROCONTROLLER |