Part Details for MPC5554MZP112 by Freescale Semiconductor
Overview of MPC5554MZP112 by Freescale Semiconductor
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (5 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for MPC5554MZP112
MPC5554MZP112 CAD Models
MPC5554MZP112 Part Data Attributes
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MPC5554MZP112
Freescale Semiconductor
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Datasheet
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MPC5554MZP112
Freescale Semiconductor
Freescale 32-bit MCU, Power Arch core, 2MB Flash, 112MHz, -40/+125degC, Automotive Grade, PBGA 416
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Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | FREESCALE SEMICONDUCTOR INC | |
Part Package Code | BGA | |
Package Description | 27 X 27 MM, 1 MM PITCH, PLASTIC, MS-034AAL-1, TEBGA-416 | |
Pin Count | 416 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A991.A.2 | |
HTS Code | 8542.31.00.01 | |
Has ADC | YES | |
Additional Feature | IT ALSO REQUIRES 3.3V SUPPLY | |
Address Bus Width | 24 | |
Bit Size | 32 | |
Clock Frequency-Max | 20 MHz | |
DAC Channels | NO | |
DMA Channels | NO | |
External Data Bus Width | 32 | |
JESD-30 Code | S-PBGA-B416 | |
JESD-609 Code | e0 | |
Length | 27 mm | |
Moisture Sensitivity Level | 3 | |
Number of Terminals | 416 | |
On Chip Program ROM Width | 8 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -40 °C | |
PWM Channels | YES | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | HBGA | |
Package Equivalence Code | BGA416,26X26,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, HEAT SINK/SLUG | |
Peak Reflow Temperature (Cel) | 245 | |
Qualification Status | Not Qualified | |
RAM (bytes) | 65536 | |
ROM (words) | 2097152 | |
ROM Programmability | FLASH | |
Seated Height-Max | 2.55 mm | |
Speed | 112 MHz | |
Supply Current-Max | 600 mA | |
Supply Voltage-Max | 1.65 V | |
Supply Voltage-Min | 1.35 V | |
Supply Voltage-Nom | 1.5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | AUTOMOTIVE | |
Terminal Finish | TIN LEAD SILVER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 27 mm | |
uPs/uCs/Peripheral ICs Type | MICROCONTROLLER |
Alternate Parts for MPC5554MZP112
This table gives cross-reference parts and alternative options found for MPC5554MZP112. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MPC5554MZP112, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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MPC5554AZP132 | Freescale 32-bit MCU, Power Arch core, 2MB Flash, 132MHz, -55/+125degC, Automotive Grade, PBGA 416 | Freescale Semiconductor | MPC5554MZP112 vs MPC5554AZP132 |
MPC5554MZP132R2 | Freescale 32-bit MCU, Power Arch core, 2MB Flash, 132MHz, -40/+125degC, Automotive Grade, PBGA 416 | Freescale Semiconductor | MPC5554MZP112 vs MPC5554MZP132R2 |
MPC5554AVR132 | 32-BIT, FLASH, 132MHz, MICROCONTROLLER, PBGA416, 27 X 27 MM, 1 MM PITCH, LEAD FREE, PLASTIC, MS-034AAL-1, TEPBGA-416 | Freescale Semiconductor | MPC5554MZP112 vs MPC5554AVR132 |
MPC5554AZP132R2 | 32-BIT, FLASH, 132MHz, MICROCONTROLLER, PBGA416, 27 X 27 MM, 1 MM PITCH, PLASTIC, MS-034AAL-1, TEBGA-416 | Freescale Semiconductor | MPC5554MZP112 vs MPC5554AZP132R2 |
MPC5554MVR132 | 32-BIT, FLASH, 132MHz, MICROCONTROLLER, PBGA416, 27 X 27 MM, 1 MM PITCH, LEAD FREE, PLASTIC, MS-034AAL-1, TEPBGA-416 | Freescale Semiconductor | MPC5554MZP112 vs MPC5554MVR132 |