Part Details for MPC5200VR400 by NXP Semiconductors
Overview of MPC5200VR400 by NXP Semiconductors
- Distributor Offerings: (8 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Computing and Data Storage
Price & Stock for MPC5200VR400
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
25K6097
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Newark | Ic, microprocessor,32-Bit, bga,272Pin, plastic Rohs Compliant: Yes |Nxp MPC5200VR400 RoHS: Compliant Min Qty: 200 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$56.8700 | Buy Now |
DISTI #
MPC5200VR400-ND
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DigiKey | IC MPU MPC52XX 400MHZ 272BGA Min Qty: 1 Lead time: 13 Weeks Container: Tray |
200 In Stock |
|
$64.5704 / $81.6400 | Buy Now |
DISTI #
MPC5200VR400
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Avnet Americas | MPU MPC52xx RISC 32-Bit 400MHz 2.5V/3.3V 272-Pin BGA Tray - Trays (Alt: MPC5200VR400) RoHS: Compliant Min Qty: 200 Package Multiple: 200 Lead time: 13 Weeks, 0 Days Container: Tray | 0 |
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$48.5090 | Buy Now |
DISTI #
841-MPC5200VR400
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Mouser Electronics | Microprocessors - MPU NO-PB COMM 5200 400MHZ RoHS: Compliant | 200 |
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$56.4900 / $76.5500 | Buy Now |
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Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 200 Package Multiple: 200 Lead time: 13 Weeks Container: Tray | 0Tray |
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$66.7900 | Buy Now |
DISTI #
MPC5200VR400
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Avnet Silica | MPU MPC52xx RISC 32-Bit 400MHz 2.5V/3.3V 272-Pin BGA Tray (Alt: MPC5200VR400) RoHS: Compliant Min Qty: 40 Package Multiple: 40 Lead time: 15 Weeks, 0 Days | Silica - 0 |
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Buy Now | |
DISTI #
MPC5200VR400
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EBV Elektronik | MPU MPC52xx RISC 32-Bit 400MHz 2.5V/3.3V 272-Pin BGA Tray (Alt: MPC5200VR400) RoHS: Compliant Min Qty: 40 Package Multiple: 40 Lead time: 15 Weeks, 0 Days | EBV - 0 |
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Buy Now | |
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Flip Electronics | Stock, ship today | 160 |
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RFQ |
Part Details for MPC5200VR400
MPC5200VR400 CAD Models
MPC5200VR400 Part Data Attributes
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MPC5200VR400
NXP Semiconductors
Buy Now
Datasheet
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Compare Parts:
MPC5200VR400
NXP Semiconductors
MICROPROCESSOR
|
Rohs Code | Yes | |
Part Life Cycle Code | Not Recommended | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Package Description | TEBGA-272 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.A.2 | |
HTS Code | 8542.31.00.01 | |
Factory Lead Time | 13 Weeks | |
Samacsys Manufacturer | NXP | |
Address Bus Width | 13 | |
Boundary Scan | YES | |
External Data Bus Width | 32 | |
Format | FLOATING POINT | |
Integrated Cache | YES | |
JESD-30 Code | S-PBGA-B272 | |
JESD-609 Code | e1 | |
Length | 27 mm | |
Low Power Mode | YES | |
Moisture Sensitivity Level | 3 | |
Number of Terminals | 272 | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Peak Reflow Temperature (Cel) | 260 | |
Seated Height-Max | 2.65 mm | |
Speed | 400 MHz | |
Supply Voltage-Max | 1.58 V | |
Supply Voltage-Min | 1.42 V | |
Supply Voltage-Nom | 1.5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Width | 27 mm | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR |