Part Details for MP8795GLE-Z by Monolithic Power Systems

A good PCB layout for the MP8795GLE-Z should prioritize thermal dissipation. Place the device near a thermal pad or a heat sink, and ensure good airflow around the component. Use a 2-layer or 4-layer PCB with a solid ground plane to reduce thermal resistance. Keep the input and output capacitors close to the device to minimize parasitic inductance.

To optimize output voltage accuracy, ensure that the feedback resistors (R1 and R2) have a 1% tolerance or better. Use a high-precision voltage reference, and consider adding a capacitor (e.g., 10nF) in parallel with R2 to filter out noise. Additionally, minimize the distance between the feedback pin and the output capacitor to reduce noise coupling.

For the MP8795GLE-Z, use a low-ESR ceramic capacitor (e.g., X5R or X7R) with a value between 4.7μF and 10μF. This will help to filter out input noise and ensure stable operation. Avoid using electrolytic capacitors, as they may not provide sufficient filtering.

During power-up, ensure that the EN pin is pulled high (or connected to VIN) after the input voltage has reached a stable level (typically > 2.5V). During power-down, pull the EN pin low before the input voltage drops below 2.5V. This will prevent unwanted switching and ensure a clean shutdown.

The MP8795GLE-Z can deliver up to 2A of output current. However, the actual maximum current depends on the input voltage, output voltage, and thermal conditions. Ensure that the device is properly heatsinked and that the output current is within the recommended range to prevent overheating and damage.