Part Details for MNR32J0ABJ111 by ROHM Semiconductor
Overview of MNR32J0ABJ111 by ROHM Semiconductor
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Applications
Space Technology
Environmental Monitoring
Internet of Things (IoT)
Industrial Automation
Smart Cities
Transportation and Logistics
Agriculture Technology
Medical Imaging
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Automotive
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Aerospace and Defense
Healthcare
Renewable Energy
Robotics and Drones
Part Details for MNR32J0ABJ111
MNR32J0ABJ111 CAD Models
MNR32J0ABJ111 Part Data Attributes
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MNR32J0ABJ111
ROHM Semiconductor
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Datasheet
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MNR32J0ABJ111
ROHM Semiconductor
Array/Network Resistor, Isolated, Metal Glaze/thick Film, 0.125W, 110ohm, 200V, 5% +/-Tol, 200ppm/Cel, Surface Mount, 1012, CHIP
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Rohs Code | Yes | |
Part Life Cycle Code | End Of Life | |
Ihs Manufacturer | ROHM CO LTD | |
Package Description | CHIP | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8533.21.00.20 | |
Construction | Rectangular | |
Element Power Dissipation | 0.125 W | |
First Element Resistance | 110 Ω | |
JESD-609 Code | e3 | |
Mounting Feature | SURFACE MOUNT | |
Network Type | ISOLATED | |
Number of Elements | 1 | |
Number of Functions | 2 | |
Number of Terminals | 4 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -55 °C | |
Package Height | 0.55 mm | |
Package Length | 2.6 mm | |
Package Shape | RECTANGULAR PACKAGE | |
Package Style | SMT | |
Package Width | 3.1 mm | |
Packing Method | TR, EMBOSSED, 7 INCH | |
Rated Temperature | 70 °C | |
Resistance | 110 Ω | |
Resistor Type | ARRAY/NETWORK RESISTOR | |
Second/Last Element Resistance | 110 Ω | |
Size Code | 1210 | |
Surface Mount | YES | |
Technology | METAL GLAZE/THICK FILM | |
Temperature Coefficient | 200 ppm/°C | |
Terminal Finish | TIN OVER NICKEL | |
Terminal Shape | WRAPAROUND | |
Tolerance | 5% | |
Working Voltage | 200 V |