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Power Circuits / Power Management Circuits / MMPF0100F6ANES
Datasheets
MMPF0100F6ANES by:
Freescale Semiconductor
Freescale Semiconductor
NXP Semiconductors
Not Found

Power Management IC, i.MX6, pre-prog ,4/6 buck, 6 LDO, 1 boost, QFN 56, Tray

Part Details for MMPF0100F6ANES by Freescale Semiconductor

Results Overview of MMPF0100F6ANES by Freescale Semiconductor

Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.

Applications Energy and Power Systems Transportation and Logistics Renewable Energy Automotive

MMPF0100F6ANES Information

MMPF0100F6ANES by Freescale Semiconductor is a Power Management Circuit.
Power Management Circuits are under the broader part category of Power Circuits.

A power circuit delivers electricity in order to operate a load for an electronic device. Power circuits include transformers, generators and switches. Read more about Power Circuits on our Power Circuits part category page.

Price & Stock for MMPF0100F6ANES

Part # Distributor Description Stock Price Buy
Chip 1 Exchange INSTOCK 249
RFQ
Vyrian Other Function Semiconductors 49
RFQ

Part Details for MMPF0100F6ANES

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MMPF0100F6ANES Part Data Attributes

Parametric Data
MMPF0100F6ANES Freescale Semiconductor
Buy Now Datasheet
Compare Parts:
MMPF0100F6ANES Freescale Semiconductor Power Management IC, i.MX6, pre-prog ,4/6 buck, 6 LDO, 1 boost, QFN 56, Tray
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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC
Package Description 8 X 8 MM, 0.85 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, QFN-56
Reach Compliance Code compliant
Adjustable Threshold YES
Analog IC - Other Type INTEGRATED POWER MANAGEMENT UNIT
JESD-30 Code S-XQCC-N56
JESD-609 Code e3
Length 8 mm
Moisture Sensitivity Level 3
Number of Channels 14
Number of Functions 1
Number of Terminals 56
Operating Temperature-Max 105 °C
Operating Temperature-Min -40 °C
Package Body Material UNSPECIFIED
Package Code HVQCCN
Package Shape SQUARE
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Seated Height-Max 0.9 mm
Supply Voltage-Max (Vsup) 4.5 V
Supply Voltage-Min (Vsup) 2.8 V
Supply Voltage-Nom (Vsup) 3.6 V
Surface Mount YES
Temperature Grade INDUSTRIAL
Terminal Finish MATTE TIN
Terminal Form NO LEAD
Terminal Pitch 0.5 mm
Terminal Position QUAD
Width 8 mm

Alternate Parts for MMPF0100F6ANES

This table gives cross-reference parts and alternative options found for MMPF0100F6ANES. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MMPF0100F6ANES, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
MMPF0100F6ANES NXP Semiconductors $6.5567 14-CHANNEL POWER SUPPLY SUPPORT CKT, QCC56 MMPF0100F6ANES vs MMPF0100F6ANES

MMPF0100F6ANES Related Parts

MMPF0100F6ANES Frequently Asked Questions (FAQ)

  • The recommended PCB layout for optimal performance involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing the length of the traces between the device and the capacitors. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.

  • To ensure the device is properly powered up and configured, follow the power-up sequence outlined in the datasheet, and make sure to configure the device's registers according to the application requirements. Also, ensure that the input voltage is within the recommended range and that the device is properly decoupled.

  • The MMPF0100F6ANES has a thermal pad that must be connected to a solid ground plane to ensure proper heat dissipation. The device's junction temperature should be kept below 125°C, and the PCB should be designed to minimize thermal resistance. Additionally, the device's power dissipation should be calculated and ensured to be within the recommended limits.

  • To troubleshoot issues with the device's output voltage regulation, check the input voltage, output voltage, and output current to ensure they are within the recommended ranges. Also, verify that the device's configuration registers are set correctly, and that the output capacitors are properly sized and connected. If issues persist, consult the datasheet and application notes for further guidance.

  • The MMPF0100F6ANES is a switching regulator, and as such, it can generate electromagnetic interference (EMI). To minimize EMI, use a shielded enclosure, keep the device and its components away from sensitive circuits, and use EMI filters or shielding on the input and output lines. Additionally, ensure that the device is properly decoupled and that the PCB is designed to minimize electromagnetic radiation.