Part Details for MMA7260QR2 by NXP Semiconductors
Overview of MMA7260QR2 by NXP Semiconductors
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- Part Data Attributes: (Available)
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Applications
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Medical Imaging
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Healthcare
Communication and Networking
Entertainment and Gaming
Robotics and Drones
Part Details for MMA7260QR2
MMA7260QR2 CAD Models
MMA7260QR2 Part Data Attributes:
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MMA7260QR2
NXP Semiconductors
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Datasheet
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MMA7260QR2
NXP Semiconductors
Analog Circuit
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Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Package Description | HBCC, LCC16,.23SQ,40 | |
Reach Compliance Code | unknown | |
HTS Code | 8542.39.00.01 | |
Samacsys Manufacturer | NXP | |
Analog IC - Other Type | ANALOG CIRCUIT | |
JESD-30 Code | S-XBCC-B16 | |
Length | 6 mm | |
Number of Channels | 1 | |
Number of Functions | 1 | |
Number of Terminals | 16 | |
Operating Temperature-Max | 105 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | UNSPECIFIED | |
Package Code | HBCC | |
Package Equivalence Code | LCC16,.23SQ,40 | |
Package Shape | SQUARE | |
Package Style | CHIP CARRIER, HEAT SINK/SLUG | |
Peak Reflow Temperature (Cel) | 260 | |
Seated Height-Max | 1.55 mm | |
Supply Voltage-Max (Vsup) | 3.6 V | |
Supply Voltage-Min (Vsup) | 2.2 V | |
Supply Voltage-Nom (Vsup) | 3.3 V | |
Surface Mount | YES | |
Temperature Grade | INDUSTRIAL | |
Terminal Form | BUTT | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Width | 6 mm |