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Part Details for MM9Z1J638BM2EP by Freescale Semiconductor
Overview of MM9Z1J638BM2EP by Freescale Semiconductor
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Applications
Energy and Power Systems
Renewable Energy
Automotive
Part Details for MM9Z1J638BM2EP
MM9Z1J638BM2EP CAD Models
MM9Z1J638BM2EP Part Data Attributes:
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MM9Z1J638BM2EP
Freescale Semiconductor
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Datasheet
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MM9Z1J638BM2EP
Freescale Semiconductor
SPECIALTY ANALOG CIRCUIT
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | FREESCALE SEMICONDUCTOR INC | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | NXP | |
| Analog IC - Other Type | ANALOG CIRCUIT | |
| JESD-30 Code | S-PQCC-N48 | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 48 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QCCN | |
| Package Equivalence Code | LCC48,.27SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Surface Mount | YES | |
| Temperature Grade | AUTOMOTIVE | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | QUAD | |
| Time@Peak Reflow Temperature-Max (s) | 40 |