Part Details for MM912JP812AMAF by NXP Semiconductors
Overview of MM912JP812AMAF by NXP Semiconductors
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Security and Surveillance
Audio and Video Systems
Transportation and Logistics
Renewable Energy
Automotive
Robotics and Drones
Price & Stock for MM912JP812AMAF
Part # | Distributor | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
DISTI #
MM912JP812AMAF
|
Avnet Americas | MCU 16-bit S12 CISC 128KB Flash 5V 100-Pin LQFP EP Tray - Trays (Alt: MM912JP812AMAF) RoHS: Compliant Min Qty: 90 Package Multiple: 90 Container: Tray | 0 |
|
RFQ |
Part Details for MM912JP812AMAF
MM912JP812AMAF CAD Models
MM912JP812AMAF Part Data Attributes
|
MM912JP812AMAF
NXP Semiconductors
Buy Now
|
Compare Parts:
MM912JP812AMAF
NXP Semiconductors
SPECIALTY MICROPROCESSOR CIRCUIT
|
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Package Description | HLFQFP, | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.A.2 | |
HTS Code | 8542.39.00.01 | |
JESD-30 Code | S-PQFP-G100 | |
JESD-609 Code | e3 | |
Length | 14 mm | |
Moisture Sensitivity Level | 3 | |
Number of Terminals | 100 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | HLFQFP | |
Package Shape | SQUARE | |
Package Style | FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Seated Height-Max | 1.6 mm | |
Supply Voltage-Max | 36 V | |
Supply Voltage-Min | 4.7 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | AUTOMOTIVE | |
Terminal Finish | Matte Tin (Sn) | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.5 mm | |
Terminal Position | QUAD | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Width | 14 mm | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |