MM912JP812AMAF by:

SPECIALTY MICROPROCESSOR CIRCUIT

Part Details for MM912JP812AMAF by NXP Semiconductors

Overview of MM912JP812AMAF by NXP Semiconductors

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Applications Security and Surveillance Audio and Video Systems Transportation and Logistics Renewable Energy Automotive Robotics and Drones

Price & Stock for MM912JP812AMAF

Part # Distributor Description Stock Price Buy
DISTI # MM912JP812AMAF
Avnet Americas MCU 16-bit S12 CISC 128KB Flash 5V 100-Pin LQFP EP Tray - Trays (Alt: MM912JP812AMAF) RoHS: Compliant Min Qty: 90 Package Multiple: 90 Container: Tray 0
RFQ

Part Details for MM912JP812AMAF

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MM912JP812AMAF Part Data Attributes

MM912JP812AMAF NXP Semiconductors
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MM912JP812AMAF NXP Semiconductors SPECIALTY MICROPROCESSOR CIRCUIT
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS
Package Description HLFQFP,
Reach Compliance Code compliant
ECCN Code 3A991.A.2
HTS Code 8542.39.00.01
JESD-30 Code S-PQFP-G100
JESD-609 Code e3
Length 14 mm
Moisture Sensitivity Level 3
Number of Terminals 100
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code HLFQFP
Package Shape SQUARE
Package Style FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260
Seated Height-Max 1.6 mm
Supply Voltage-Max 36 V
Supply Voltage-Min 4.7 V
Surface Mount YES
Technology CMOS
Temperature Grade AUTOMOTIVE
Terminal Finish Matte Tin (Sn)
Terminal Form GULL WING
Terminal Pitch 0.5 mm
Terminal Position QUAD
Time@Peak Reflow Temperature-Max (s) 40
Width 14 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT

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