There are no models available for this part yet.
Overview of MM53143J by National Semiconductor Corporation
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 crosses )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 crosses )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Education and Research
Environmental Monitoring
Internet of Things (IoT)
Industrial Automation
Computing and Data Storage
Aerospace and Defense
Healthcare
Agriculture Technology
Medical Imaging
Telecommunications
Automotive
CAD Models for MM53143J by National Semiconductor Corporation
Part Data Attributes for MM53143J by National Semiconductor Corporation
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|
|
|---|---|
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Rohs Code
|
No
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|
Part Life Cycle Code
|
Obsolete
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|
Ihs Manufacturer
|
NATIONAL SEMICONDUCTOR CORP
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Reach Compliance Code
|
compliant
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HTS Code
|
8542.39.00.01
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JESD-30 Code
|
R-XDIP-T18
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JESD-609 Code
|
e0
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Number of Terminals
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18
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|
Operating Temperature-Max
|
70 °C
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Operating Temperature-Min
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-30 °C
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Package Body Material
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CERAMIC
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Package Code
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DIP
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Package Equivalence Code
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DIP18,.3
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Package Shape
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RECTANGULAR
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Package Style
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IN-LINE
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Qualification Status
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Not Qualified
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Surface Mount
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NO
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Technology
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CMOS
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Temperature Grade
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OTHER
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Terminal Finish
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Tin/Lead (Sn/Pb)
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|
Terminal Form
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THROUGH-HOLE
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Terminal Pitch
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2.54 mm
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Terminal Position
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DUAL
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