Datasheets
MLP2N06CLG by: onsemi

62 V, 2.0 A Power MOSFET, Logic Level, TO-220 3 LEAD STANDARD, 50-TUBE

Part Details for MLP2N06CLG by onsemi

Results Overview of MLP2N06CLG by onsemi

Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.

Applications Environmental Monitoring Industrial Automation

MLP2N06CLG Information

MLP2N06CLG by onsemi is a Power Field-Effect Transistor.
Power Field-Effect Transistors are under the broader part category of Transistors.

A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.

Price & Stock for MLP2N06CLG

Part # Distributor Description Stock Price Buy
DISTI # 488-MLP2N06CLG-ND
DigiKey 62 V, 2.0 A POWER MOSFET, LOGIC Lead time: 8 Weeks Container: Bulk Limited Supply - Call
Buy Now

Part Details for MLP2N06CLG

MLP2N06CLG CAD Models

There are no models available for this part yet.

Sign in to request this CAD model.

Register or Sign In

MLP2N06CLG Part Data Attributes

MLP2N06CLG onsemi
Buy Now Datasheet
Compare Parts:
MLP2N06CLG onsemi 62 V, 2.0 A Power MOSFET, Logic Level, TO-220 3 LEAD STANDARD, 50-TUBE
Select a part to compare:
Pbfree Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer ON SEMICONDUCTOR
Part Package Code TO-220 3 LEAD STANDARD
Package Description FLANGE MOUNT, R-PSFM-T3
Pin Count 3
Manufacturer Package Code 221A
Reach Compliance Code not_compliant
ECCN Code EAR99
Samacsys Manufacturer onsemi
Additional Feature ESD PROTECTED
Avalanche Energy Rating (Eas) 80 mJ
Case Connection DRAIN
Configuration SINGLE WITH BUILT-IN BIPOLAR TRANSISTOR, DIODE AND RESISTOR
DS Breakdown Voltage-Min 58 V
Drain Current-Max (ID) 2 A
Drain-source On Resistance-Max 0.4 Ω
FET Technology METAL-OXIDE SEMICONDUCTOR
JEDEC-95 Code TO-220AB
JESD-30 Code R-PSFM-T3
JESD-609 Code e3
Number of Elements 1
Number of Terminals 3
Operating Mode ENHANCEMENT MODE
Operating Temperature-Max 150 °C
Package Body Material PLASTIC/EPOXY
Package Shape RECTANGULAR
Package Style FLANGE MOUNT
Peak Reflow Temperature (Cel) 260
Polarity/Channel Type N-CHANNEL
Power Dissipation-Max (Abs) 40 W
Qualification Status Not Qualified
Surface Mount NO
Terminal Finish Tin (Sn)
Terminal Form THROUGH-HOLE
Terminal Position SINGLE
Time@Peak Reflow Temperature-Max (s) 40
Transistor Application SWITCHING
Transistor Element Material SILICON

Alternate Parts for MLP2N06CLG

This table gives cross-reference parts and alternative options found for MLP2N06CLG. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MLP2N06CLG, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
MLP2N06CL onsemi Check for Price 62 V, 2.0 A Power MOSFET, Logic Level, TO-220 3 LEAD STANDARD, 50-TUBE MLP2N06CLG vs MLP2N06CL

MLP2N06CLG Frequently Asked Questions (FAQ)

  • The recommended PCB layout for optimal thermal performance involves placing a thermal pad on the bottom of the package, using a minimum of 2 oz copper thickness, and ensuring good thermal conduction to the surrounding copper area. A thermal via array can also be used to improve heat dissipation.

  • To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, including the maximum junction temperature (Tj) of 150°C. Additionally, consider using a heat sink, ensuring good thermal conduction, and monitoring the device's thermal performance.

  • The MLP2N06CLG has built-in ESD protection, but it's still recommended to follow proper ESD handling procedures during assembly and testing. A human body model (HBM) of ±2 kV and a machine model (MM) of ±200 V are recommended for ESD protection.

  • Yes, the MLP2N06CLG is suitable for high-reliability and automotive applications. It's AEC-Q101 qualified and meets the requirements for automotive-grade devices. However, it's essential to follow the recommended operating conditions and ensure proper design and testing for the specific application.

  • The recommended soldering conditions for the MLP2N06CLG include a peak temperature of 260°C, a soldering time of 10 seconds, and a soldering method that follows the IPC J-STD-020 standard.