Part Details for MLG0603Q13NJT by TDK Corporation
Overview of MLG0603Q13NJT by TDK Corporation
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- Part Data Attributes: (Available)
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Part Details for MLG0603Q13NJT
MLG0603Q13NJT CAD Models
MLG0603Q13NJT Part Data Attributes
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MLG0603Q13NJT
TDK Corporation
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Datasheet
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MLG0603Q13NJT
TDK Corporation
General Purpose Inductor, 0.013uH, 5%, 1 Element, Ceramic-Core, SMD, 0603, CHIP, 0603, ROHS COMPLIANT
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Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | TDK CORP | |
Package Description | 0603 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8504.50.80.00 | |
Samacsys Manufacturer | TDK | |
Case/Size Code | 0603 | |
Construction | Multilayer Chip | |
Core Material | CERAMIC | |
DC Resistance | 1 Ω | |
Inductance-Nom (L) | 0.013 µH | |
Inductor Application | RF INDUCTOR | |
Inductor Type | GENERAL PURPOSE INDUCTOR | |
JESD-609 Code | e3 | |
Number of Functions | 1 | |
Number of Terminals | 2 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -55 °C | |
Package Height | 0.3 mm | |
Package Length | 0.6 mm | |
Package Style | SMT | |
Package Width | 0.3 mm | |
Packing Method | TR | |
Quality Factor-Min (at L-nom) | 6 | |
Rated Current-Max | 0.18 A | |
Self Resonance Frequency | 3000 MHz | |
Shape/Size Description | RECTANGULAR PACKAGE | |
Shielded | NO | |
Surface Mount | YES | |
Terminal Finish | Matte Tin (Sn) | |
Terminal Placement | DUAL ENDED | |
Terminal Shape | WRAPAROUND | |
Test Frequency | 100 MHz | |
Tolerance | 5% |