Part Details for MK21DN512VMC5 by Freescale Semiconductor
Overview of MK21DN512VMC5 by Freescale Semiconductor
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Part Details for MK21DN512VMC5
MK21DN512VMC5 CAD Models
MK21DN512VMC5 Part Data Attributes
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MK21DN512VMC5
Freescale Semiconductor
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Datasheet
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MK21DN512VMC5
Freescale Semiconductor
Kinetis K 32-bit MCU, ARM Cortex-M4 core, 512KB Flash, 50MHz, USB, MAPBGA 121
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | FREESCALE SEMICONDUCTOR INC | |
Package Description | 8 X 8 MM, MAPBGA-121 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.A.2 | |
HTS Code | 8542.31.00.01 | |
Samacsys Manufacturer | NXP | |
Has ADC | YES | |
Address Bus Width | ||
Bit Size | 32 | |
CPU Family | CORTEX-M4 | |
Clock Frequency-Max | 50 MHz | |
DAC Channels | YES | |
DMA Channels | YES | |
External Data Bus Width | ||
JESD-30 Code | S-PBGA-B121 | |
Moisture Sensitivity Level | 3 | |
Number of Terminals | 121 | |
On Chip Program ROM Width | 8 | |
Operating Temperature-Max | 105 °C | |
Operating Temperature-Min | -40 °C | |
PWM Channels | YES | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA121,11X11,25 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
RAM (bytes) | 65536 | |
ROM (words) | 524288 | |
ROM Programmability | FLASH | |
Speed | 50 MHz | |
Supply Current-Max | 19.3 mA | |
Supply Voltage-Max | 3.6 V | |
Supply Voltage-Min | 1.71 V | |
Supply Voltage-Nom | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN SILVER COPPER OVER NICKEL | |
Terminal Form | BALL | |
Terminal Pitch | 0.635 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |