| Part # | Manufacturer | Description | Stock | Price | Buy | ||
|---|---|---|---|---|---|---|---|
|
DISTI #
70AC4288
|
Newark | I.mxrt1060/ Tray Rohs Compliant: Yes |Nxp MIMXRT1062CVL5A RoHS: Compliant Min Qty: 240 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
|
$7.2600 / $8.5900 | Buy Now | |
|
DISTI #
568-14669-ND
|
DigiKey | IC MCU 32BIT 196MAPBGA Lead time: 13 Weeks Container: Tray | Limited Supply - Call |
|
Buy Now | ||
|
DISTI #
MIMXRT1062CVL5A
|
Avnet Americas | MPU i.MX RT1060 RISC 32-Bit 528MHz 1.8V/3.3V 196-Pin MAPBGA Tray - Trays (Alt: MIMXRT1062CVL5A) RoHS: Compliant Min Qty: 480 Package Multiple: 240 Lead time: 13 Weeks, 0 Days Container: Tray | 0 |
|
$7.2556 | Buy Now | |
| Future Electronics | RT1060 : 3.3 V 528 MHz ARM®Cortex®-M7 i.MX Crossover Processor - MAPBGA-196 RoHS: Compliant pbFree: Yes Min Qty: 720 Package Multiple: 240 Lead time: 13 Weeks Container: Tray | 0Tray |
|
$7.1200 | Buy Now | ||
|
DISTI #
MIMXRT1062CVL5A
|
Avnet Silica | MPU i.MX RT1060 RISC 32-Bit 528MHz 1.8V/3.3V 196-Pin MAPBGA Tray (Alt: MIMXRT1062CVL5A) RoHS: Compliant Min Qty: 240 Package Multiple: 240 Lead time: 15 Weeks, 0 Days | Silica - 0 |
|
Buy Now | ||
|
DISTI #
MIMXRT1062CVL5A
|
EBV Elektronik | MPU i.MX RT1060 RISC 32-Bit 528MHz 1.8V/3.3V 196-Pin MAPBGA Tray (Alt: MIMXRT1062CVL5A) RoHS: Compliant Min Qty: 240 Package Multiple: 240 Lead time: 15 Weeks, 0 Days | EBV - 0 |
|
Buy Now |
|
|
|
|---|---|
|
Rohs Code
|
Yes
|
|
Part Life Cycle Code
|
Not Recommended
|
|
Ihs Manufacturer
|
NXP SEMICONDUCTORS
|
|
Package Description
|
MABGA-196
|
|
Reach Compliance Code
|
compliant
|
|
ECCN Code
|
5A992.C
|
|
HTS Code
|
8542.31.00.01
|
|
Factory Lead Time
|
13 Weeks
|
|
Date Of Intro
|
2018-08-28
|
|
Samacsys Manufacturer
|
NXP
|
|
JESD-30 Code
|
S-PBGA-B196
|
|
JESD-609 Code
|
e1
|
|
Length
|
10 mm
|
|
Moisture Sensitivity Level
|
3
|
|
Number of Terminals
|
196
|
|
Operating Temperature-Max
|
105 °C
|
|
Operating Temperature-Min
|
-40 °C
|
|
Package Body Material
|
PLASTIC/EPOXY
|
|
Package Code
|
LFBGA
|
|
Package Equivalence Code
|
BGA196,14X14,25
|
|
Package Shape
|
SQUARE
|
|
Package Style
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
|
Peak Reflow Temperature (Cel)
|
260
|
|
Seated Height-Max
|
1.43 mm
|
|
Supply Voltage-Max
|
1.26 V
|
|
Supply Voltage-Min
|
1.15 V
|
|
Surface Mount
|
YES
|
|
Technology
|
CMOS
|
|
Temperature Grade
|
INDUSTRIAL
|
|
Terminal Finish
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
|
Terminal Form
|
BALL
|
|
Terminal Pitch
|
0.65 mm
|
|
Terminal Position
|
BOTTOM
|
|
Time@Peak Reflow Temperature-Max (s)
|
40
|
|
Width
|
10 mm
|
|
uPs/uCs/Peripheral ICs Type
|
SoC
|
