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Multifunction Peripheral, CMOS, PBGA417
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Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
84AC5943
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Newark | I.mx 8Dualx Rohs Compliant: Yes |Nxp MIMX8UX6AVOFZAC RoHS: Compliant Min Qty: 90 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
|
$51.4900 / $54.6400 | Buy Now |
DISTI #
568-MIMX8UX6AVOFZAC-ND
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DigiKey | I.MX8 QXP 17X17 Min Qty: 90 Lead time: 26 Weeks Container: Tray | Temporarily Out of Stock |
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$55.5769 | Buy Now |
DISTI #
MIMX8UX6AVOFZAC
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Avnet Americas | i.MX8 QXP 17x17 - Trays (Alt: MIMX8UX6AVOFZAC) RoHS: Not Compliant Min Qty: 90 Package Multiple: 90 Lead time: 26 Weeks, 0 Days Container: Tray | 0 |
|
RFQ | |
DISTI #
771-MIMX8UX6AVOFZAC
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Mouser Electronics | Microprocessors - MPU i.MX 8DualX RoHS: Compliant | 89 |
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$53.6000 / $75.3200 | Buy Now |
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ComSIT USA | Microprocessors - MPU i.MX 8DualX RoHS: Compliant |
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RFQ | |
DISTI #
MIMX8UX6AVOFZAC
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Avnet Silica | i.MX8 QXP 17x17 (Alt: MIMX8UX6AVOFZAC) RoHS: Compliant Min Qty: 90 Package Multiple: 90 Lead time: 41 Weeks, 0 Days | Silica - 0 |
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Buy Now | |
DISTI #
MIMX8UX6AVOFZAC
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EBV Elektronik | i.MX8 QXP 17x17 (Alt: MIMX8UX6AVOFZAC) RoHS: Compliant Min Qty: 90 Package Multiple: 90 Lead time: 41 Weeks, 0 Days | EBV - 0 |
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Buy Now |
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MIMX8UX6AVOFZAC
NXP Semiconductors
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Datasheet
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Compare Parts:
MIMX8UX6AVOFZAC
NXP Semiconductors
Multifunction Peripheral, CMOS, PBGA417
|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Package Description | FCPBGA-417 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 | |
Factory Lead Time | 26 Weeks | |
Date Of Intro | 2020-04-09 | |
Samacsys Manufacturer | NXP | |
Boundary Scan | YES | |
Bus Compatibility | CAN(3), SAI(4), SPI(4), UART(6) | |
Clock Frequency-Max | 24 MHz | |
JESD-30 Code | S-PBGA-B417 | |
Length | 17 mm | |
Moisture Sensitivity Level | 3 | |
Number of I/O Lines | 75 | |
Number of Terminals | 417 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | FBGA | |
Package Equivalence Code | BGA417,29X29,32 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, FINE PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
RAM (words) | 512000 | |
Seated Height-Max | 2.73 mm | |
Supply Current-Max | 5000 mA | |
Supply Voltage-Max | 1.15 V | |
Supply Voltage-Min | 1.05 V | |
Supply Voltage-Nom | 1.1 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | AUTOMOTIVE | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Width | 17 mm | |
uPs/uCs/Peripheral ICs Type | MULTIFUNCTION PERIPHERAL |