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Part Details for MIMX8UX6AVOFZAC by NXP Semiconductors
Overview of MIMX8UX6AVOFZAC by NXP Semiconductors
- Distributor Offerings: (7 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Industrial Automation
Renewable Energy
Robotics and Drones
Price & Stock for MIMX8UX6AVOFZAC
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
84AC5943
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Newark | I.mx 8Dualx Rohs Compliant: Yes |Nxp MIMX8UX6AVOFZAC RoHS: Compliant Min Qty: 90 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$51.4900 / $54.6400 | Buy Now |
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DISTI #
568-MIMX8UX6AVOFZAC-ND
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DigiKey | I.MX8 QXP 17X17 Min Qty: 90 Lead time: 26 Weeks Container: Tray | Temporarily Out of Stock |
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$55.5769 | Buy Now |
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DISTI #
MIMX8UX6AVOFZAC
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Avnet Americas | i.MX8 QXP 17x17 - Trays (Alt: MIMX8UX6AVOFZAC) RoHS: Not Compliant Min Qty: 90 Package Multiple: 90 Lead time: 26 Weeks, 0 Days Container: Tray | 0 |
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RFQ | |
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DISTI #
771-MIMX8UX6AVOFZAC
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Mouser Electronics | Microprocessors - MPU i.MX 8DualX RoHS: Compliant | 89 |
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$53.6000 / $75.3200 | Buy Now |
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ComSIT USA | Microprocessors - MPU i.MX 8DualX RoHS: Compliant |
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|
RFQ | |
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DISTI #
MIMX8UX6AVOFZAC
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Avnet Silica | i.MX8 QXP 17x17 (Alt: MIMX8UX6AVOFZAC) RoHS: Compliant Min Qty: 90 Package Multiple: 90 Lead time: 41 Weeks, 0 Days | Silica - 0 |
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Buy Now | |
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DISTI #
MIMX8UX6AVOFZAC
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EBV Elektronik | i.MX8 QXP 17x17 (Alt: MIMX8UX6AVOFZAC) RoHS: Compliant Min Qty: 90 Package Multiple: 90 Lead time: 41 Weeks, 0 Days | EBV - 0 |
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Buy Now |
Part Details for MIMX8UX6AVOFZAC
MIMX8UX6AVOFZAC CAD Models
MIMX8UX6AVOFZAC Part Data Attributes
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MIMX8UX6AVOFZAC
NXP Semiconductors
Buy Now
Datasheet
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Compare Parts:
MIMX8UX6AVOFZAC
NXP Semiconductors
Multifunction Peripheral, CMOS, PBGA417
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | FCPBGA-417 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Factory Lead Time | 26 Weeks | |
| Date Of Intro | 2020-04-09 | |
| Samacsys Manufacturer | NXP | |
| Boundary Scan | YES | |
| Bus Compatibility | CAN(3), SAI(4), SPI(4), UART(6) | |
| Clock Frequency-Max | 24 MHz | |
| JESD-30 Code | S-PBGA-B417 | |
| Length | 17 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of I/O Lines | 75 | |
| Number of Terminals | 417 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FBGA | |
| Package Equivalence Code | BGA417,29X29,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| RAM (words) | 512000 | |
| Seated Height-Max | 2.73 mm | |
| Supply Current-Max | 5000 mA | |
| Supply Voltage-Max | 1.15 V | |
| Supply Voltage-Min | 1.05 V | |
| Supply Voltage-Nom | 1.1 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | AUTOMOTIVE | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 17 mm | |
| uPs/uCs/Peripheral ICs Type | MULTIFUNCTION PERIPHERAL |