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Multifunction Peripheral, CMOS, PBGA486
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
85AK8825
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Newark | Mscale 845S 14X14Fcbga/ Tray Rohs Compliant: Yes |Nxp MIMX8MM5DVTLZCA RoHS: Compliant Min Qty: 152 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
|
$25.1300 / $25.8700 | Buy Now |
DISTI #
568-MIMX8MM5DVTLZCA-ND
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DigiKey | IC Min Qty: 1 Lead time: 16 Weeks Container: Tray |
152 In Stock |
|
$27.1941 / $36.2000 | Buy Now |
DISTI #
MIMX8MM5DVTLZCA
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Avnet Americas | Microprocessor, i.MX 8M Mini QuadLite, 1.8GHz, 64bit, 805mV-1.05V, 4 Core, 0°C to 95°C, FCBGA-486 - Trays (Alt: MIMX8MM5DVTLZCA) Min Qty: 152 Package Multiple: 152 Lead time: 16 Weeks, 0 Days Container: Tray | 0 |
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$27.5092 | Buy Now |
DISTI #
MIMX8MM5DVTLZCA
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Avnet Americas | Microprocessor, i.MX 8M Mini QuadLite, 1.8GHz, 64bit, 805mV-1.05V, 4 Core, 0°C to 95°C, FCBGA-486 - Trays (Alt: MIMX8MM5DVTLZCA) Min Qty: 152 Package Multiple: 152 Lead time: 16 Weeks, 0 Days Container: Tray | 0 |
|
$27.5092 | Buy Now |
DISTI #
771-MIMX8MM5DVTLZCA
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Mouser Electronics | Microprocessors - MPU mScale 845S 14X14FCBGA RoHS: Compliant | 152 |
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$27.0500 / $41.4100 | Buy Now |
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Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 152 Package Multiple: 152 Lead time: 16 Weeks Container: Tray | 0Tray |
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$24.6400 | Buy Now |
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MIMX8MM5DVTLZCA
NXP Semiconductors
Buy Now
Datasheet
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Compare Parts:
MIMX8MM5DVTLZCA
NXP Semiconductors
Multifunction Peripheral, CMOS, PBGA486
|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Package Description | LFBGA, BGA486,27X27,20 | |
Reach Compliance Code | unknown | |
ECCN Code | 5A992.C | |
HTS Code | 8542.31.00.01 | |
Factory Lead Time | 16 Weeks | |
Samacsys Manufacturer | NXP | |
JESD-30 Code | S-PBGA-B486 | |
JESD-609 Code | e2 | |
Length | 14 mm | |
Moisture Sensitivity Level | 3 | |
Number of Terminals | 486 | |
Operating Temperature-Max | 95 °C | |
Operating Temperature-Min | ||
Package Body Material | PLASTIC/EPOXY | |
Package Code | LFBGA | |
Package Equivalence Code | BGA486,27X27,20 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Seated Height-Max | 1.25 mm | |
Supply Voltage-Max | 1.05 V | |
Supply Voltage-Min | 0.95 V | |
Supply Voltage-Nom | 1 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | OTHER | |
Terminal Finish | Tin/Silver (Sn/Ag) | |
Terminal Form | BALL | |
Terminal Pitch | 0.5 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Width | 14 mm | |
uPs/uCs/Peripheral ICs Type | SoC |