Part Details for MH89790 by Microsemi Corporation
Overview of MH89790 by Microsemi Corporation
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Education and Research
Industrial Automation
Aerospace and Defense
Agriculture Technology
Renewable Energy
Robotics and Drones
Price & Stock for MH89790
| Part # | Distributor | Description | Stock | Price | Buy | |
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Chip1Cloud | 7800 |
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RFQ |
Part Details for MH89790
MH89790 CAD Models
MH89790 Part Data Attributes:
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MH89790
Microsemi Corporation
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Datasheet
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MH89790
Microsemi Corporation
IC,TRUNK INTERFACE,HYBRID,DIP,40PIN,CERAMIC
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | ZARLINK SEMICONDUCTOR INC | |
| Package Description | DIP, DIP40,1.3 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 | |
| JESD-30 Code | R-XDIP-T40 | |
| JESD-609 Code | e0 | |
| Number of Terminals | 40 | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Package Body Material | CERAMIC | |
| Package Code | DIP | |
| Package Equivalence Code | DIP40,1.3 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Qualification Status | Not Qualified | |
| Supply Current-Max | 0.05 mA | |
| Surface Mount | NO | |
| Technology | HYBRID | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL |