Part Details for MH1M08B2J-10 by Mitsubishi Electric
Overview of MH1M08B2J-10 by Mitsubishi Electric
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (1 cross)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Part Details for MH1M08B2J-10
MH1M08B2J-10 CAD Models
MH1M08B2J-10 Part Data Attributes:
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MH1M08B2J-10
Mitsubishi Electric
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Datasheet
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MH1M08B2J-10
Mitsubishi Electric
DRAM Module, 1MX8, 100ns, CMOS, SIMM-30
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Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | MITSUBISHI ELECTRIC CORP | |
Part Package Code | SIMM | |
Package Description | SIMM, SIM30 | |
Pin Count | 30 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.02 | |
Access Mode | STATIC COLUMN | |
Access Time-Max | 100 ns | |
Additional Feature | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | |
I/O Type | COMMON | |
JESD-30 Code | R-XSMA-N30 | |
Memory Density | 8388608 bit | |
Memory IC Type | DRAM MODULE | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Ports | 1 | |
Number of Terminals | 30 | |
Number of Words | 1048576 words | |
Number of Words Code | 1000000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 1MX8 | |
Output Characteristics | 3-STATE | |
Package Body Material | UNSPECIFIED | |
Package Code | SIMM | |
Package Equivalence Code | SIM30 | |
Package Shape | RECTANGULAR | |
Package Style | MICROELECTRONIC ASSEMBLY | |
Qualification Status | Not Qualified | |
Refresh Cycles | 512 | |
Seated Height-Max | 20.32 mm | |
Standby Current-Max | 0.004 A | |
Supply Current-Max | 0.48 mA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Form | NO LEAD | |
Terminal Pitch | 2.54 mm | |
Terminal Position | SINGLE |
Alternate Parts for MH1M08B2J-10
This table gives cross-reference parts and alternative options found for MH1M08B2J-10. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MH1M08B2J-10, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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MH1M08A2J-10 | DRAM Module, 1MX8, 100ns, CMOS, SIMM-30 | Mitsubishi Electric | MH1M08B2J-10 vs MH1M08A2J-10 |