Datasheets
MGA-25203-BLKG by:
Broadcom Limited
Avago Technologies
Broadcom Limited
Not Found

Narrow Band Medium Power Amplifier, 4900MHz Min, 5900MHz Max, 1 Func, GAAS, 3 X 3 MM, 1 MM HEIGHT, 16 PIN

Part Details for MGA-25203-BLKG by Broadcom Limited

Results Overview of MGA-25203-BLKG by Broadcom Limited

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MGA-25203-BLKG Information

MGA-25203-BLKG by Broadcom Limited is an RF/Microwave Amplifier.
RF/Microwave Amplifiers are under the broader part category of RF and Microwave Components.

RF and Microwave Engineering focuses on the design and operation of devices that transmit or receive radio waves. The main distinction between RF and microwave engineering is their wavelength, which influences how energy is transmitted and used in various applications. Read more about RF and Microwave Components on our RF and Microwave part category page.

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10137925-2031LF Amphenol Communications Solutions Minitek® Pwr 3.0, Dual Row, Right Angle SMT Tails and DIP Hold Down Header, 15u\\ Gold (Tin on Tails) plating, Black Color, 20 Positions, GW Compatible LCP, Tape and Reel. .

Price & Stock for MGA-25203-BLKG

Part # Distributor Description Stock Price Buy
DISTI # SMC-MGA-25203-BLKG
Sensible Micro Corporation Ic, Power Amp, 5.1-5.9Ghz, Wifi(R) And Wimax(R RoHS: Compliant Min Qty: 25 Lead time: 0 Weeks, 1 Days Date Code: 1002 Container: Tape & Reel 2
  • 100 $3.9097
  • 500 $3.8095
  • 1,000 $3.6090
$3.6090 / $3.9097 RFQ
DISTI # MGA-25203-BLKG
EBV Elektronik RF Power Amp Single 5900MHz 30dB 16Pin SMD TR (Alt: MGA-25203-BLKG) RoHS: Compliant Min Qty: 100 Package Multiple: 100 Lead time: 22 Weeks, 0 Days EBV - 0
Buy Now
Win Source Electronics 5.1 - 5.9 GHz WiFi and WiMAX Power Amplifi er (3x3mm) | IC AMP WIFI WIMAX 4.9GHZ-5.9GHZ 1976
  • 8 $6.7710
  • 18 $5.5560
  • 28 $5.3820
  • 39 $5.2090
  • 50 $5.0350
  • 67 $4.5140
$4.5140 / $6.7710 Buy Now

Part Details for MGA-25203-BLKG

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MGA-25203-BLKG Part Data Attributes

MGA-25203-BLKG Broadcom Limited
Buy Now Datasheet
Compare Parts:
MGA-25203-BLKG Broadcom Limited Narrow Band Medium Power Amplifier, 4900MHz Min, 5900MHz Max, 1 Func, GAAS, 3 X 3 MM, 1 MM HEIGHT, 16 PIN
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Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer BROADCOM INC
Package Description 3 X 3 MM, 1 MM HEIGHT, 16 PIN
Reach Compliance Code compliant
ECCN Code 5A991.G
HTS Code 8542.33.00.01
Characteristic Impedance 50 Ω
Construction COMPONENT
Gain 27 dB
Input Power-Max (CW) 15 dBm
Mounting Feature SURFACE MOUNT
Number of Functions 1
Number of Terminals 16
Operating Frequency-Max 5900 MHz
Operating Frequency-Min 4900 MHz
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Equivalence Code LCC16,.12SQ,20
Power Supplies 3.3 V
RF/Microwave Device Type NARROW BAND MEDIUM POWER
Surface Mount YES
Technology GAAS

Alternate Parts for MGA-25203-BLKG

This table gives cross-reference parts and alternative options found for MGA-25203-BLKG. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MGA-25203-BLKG, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
MGA-25203-TR1G Avago Technologies Check for Price 4900MHz - 5900MHz RF/MICROWAVE NARROW BAND MEDIUM POWER AMPLIFIER, 3 X 3 MM, 1 MM HEIGHT, 16 PIN MGA-25203-BLKG vs MGA-25203-TR1G

MGA-25203-BLKG Related Parts

MGA-25203-BLKG Frequently Asked Questions (FAQ)

  • The recommended PCB layout involves keeping the device away from high-current carrying traces, using a solid ground plane, and placing thermal vias under the device. For thermal management, a heat sink or thermal pad is recommended to keep the junction temperature below 125°C.

  • Optimization involves using simulation tools like ADS or AWR to design and optimize the input and output matching networks for maximum gain and efficiency. The goal is to achieve a good impedance match between the device and the external circuitry.

  • Recommended assembly and soldering techniques include using a reflow oven with a controlled temperature profile, avoiding excessive heat and mechanical stress, and using a solder paste with a high melting point to prevent damage during manufacturing.

  • Troubleshooting involves using tools like a spectrum analyzer or a vector network analyzer to identify the source of the issue. Debugging techniques include checking the PCB layout, component values, and soldering quality, as well as using simulation tools to model and analyze the circuit.

  • The MGA-25203-BLKG has undergone various reliability and qualification tests, including temperature cycling, humidity testing, and electrical overstress testing, to ensure its performance and reliability in various operating conditions.