Part Details for MDS212CG by Zarlink Semiconductor Inc
Overview of MDS212CG by Zarlink Semiconductor Inc
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Education and Research
Aerospace and Defense
Agriculture Technology
Robotics and Drones
Price & Stock for MDS212CG
| Part # | Distributor | Description | Stock | Price | Buy | |
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Quest Components | DATACOM, LAN SWITCHING CIRCUIT, PBGA456 | 1 |
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Part Details for MDS212CG
MDS212CG CAD Models
MDS212CG Part Data Attributes
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MDS212CG
Zarlink Semiconductor Inc
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Datasheet
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MDS212CG
Zarlink Semiconductor Inc
LAN Switching Circuit, CMOS, PBGA456, 35 X 35 MM, 2.33 MM HEIGHT, MS-034, HSBGA-456
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| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | ZARLINK SEMICONDUCTOR INC | |
| Package Description | HBGA, BGA456,26X26,50 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| JESD-30 Code | S-PBGA-B456 | |
| JESD-609 Code | e0 | |
| Length | 35 mm | |
| Number of Functions | 1 | |
| Number of Terminals | 456 | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HBGA | |
| Package Equivalence Code | BGA456,26X26,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Peak Reflow Temperature (Cel) | 225 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.46 mm | |
| Supply Voltage-Nom | 2.5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Telecom IC Type | LAN SWITCHING CIRCUIT | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm |