Part Details for MDS112CG by Zarlink Semiconductor Inc
Overview of MDS112CG by Zarlink Semiconductor Inc
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- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Energy and Power Systems
Transportation and Logistics
Renewable Energy
Automotive
Part Details for MDS112CG
MDS112CG CAD Models
MDS112CG Part Data Attributes:
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MDS112CG
Zarlink Semiconductor Inc
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Datasheet
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MDS112CG
Zarlink Semiconductor Inc
LAN Switching Circuit, CMOS, PBGA456, BGA-456
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| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | ZARLINK SEMICONDUCTOR INC | |
| Package Description | FBGA, BGA456,26X26,50 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 | |
| JESD-30 Code | S-PBGA-B456 | |
| JESD-609 Code | e0 | |
| Length | 35 mm | |
| Number of Functions | 1 | |
| Number of Terminals | 456 | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FBGA | |
| Package Equivalence Code | BGA456,26X26,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 225 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.5 mm | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Telecom IC Type | LAN SWITCHING CIRCUIT | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm |