Part Details for MCP6032-E/MSVAO by Microchip Technology Inc
Results Overview of MCP6032-E/MSVAO by Microchip Technology Inc
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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MCP6032-E/MSVAO Information
MCP6032-E/MSVAO by Microchip Technology Inc is an Operational Amplifier.
Operational Amplifiers are under the broader part category of Amplifier Circuits.
Amplifier circuits use external power to increase the amplitude of an input signal. They can be used to perform linear amplifications or logarithmic functions. Read more about Amplifier Circuits on our Amplifier Circuits part category page.
Price & Stock for MCP6032-E/MSVAO
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
MCP6032-E/MSVAO-ND
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DigiKey | IC OPAMP GP 2 CIRCUIT 8MSOP Lead time: 6 Weeks Container: Tube | Temporarily Out of Stock |
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Buy Now | |
DISTI #
MCP6032-E/MSVAO
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Microchip Technology Inc | Dual 1.8V 10kHz Op Amp, E temp, MSOP, Projected EOL: 2044-05-14 COO: Thailand ECCN: EAR99 RoHS: Compliant Lead time: 6 Weeks, 0 Days Container: Tube |
0 Alternates Available |
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$1.0800 / $1.4400 | Buy Now |
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Onlinecomponents.com | Dual Op Amp - High Precision - 0.9uA - 1.8 to 5.5 VDC - 10KHz GBP - -40°C to 125°C - 8-lead MSOP RoHS: Compliant | 0 |
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$0 | Buy Now |
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Vyrian | Amplifiers | 644 |
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RFQ |
Part Details for MCP6032-E/MSVAO
MCP6032-E/MSVAO CAD Models
MCP6032-E/MSVAO Part Data Attributes
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MCP6032-E/MSVAO
Microchip Technology Inc
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Datasheet
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MCP6032-E/MSVAO
Microchip Technology Inc
Operational Amplifier, 2 Func, 150000uV Offset-Max, CMOS, PDSO8
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Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | MICROCHIP TECHNOLOGY INC | |
Package Description | MSOP-8 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.33.00.01 | |
Factory Lead Time | 6 Weeks | |
Samacsys Manufacturer | Microchip | |
Amplifier Type | OPERATIONAL AMPLIFIER | |
Architecture | VOLTAGE-FEEDBACK | |
Average Bias Current-Max (IIB) | 0.005 µA | |
Bias Current-Max (IIB) @25C | 0.0001 µA | |
Common-mode Reject Ratio-Min | 72 dB | |
Common-mode Reject Ratio-Nom | 93 dB | |
Frequency Compensation | YES | |
Input Offset Voltage-Max | 150000 µV | |
JESD-30 Code | S-PDSO-G8 | |
JESD-609 Code | e3 | |
Length | 3 mm | |
Low-Bias | YES | |
Low-Offset | YES | |
Micropower | YES | |
Number of Functions | 2 | |
Number of Terminals | 8 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TSSOP | |
Package Equivalence Code | TSSOP8,.19 | |
Package Shape | SQUARE | |
Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | |
Packing Method | TUBE | |
Power | NO | |
Programmable Power | NO | |
Screening Level | AEC-Q100; TS 16949 | |
Seated Height-Max | 1.1 mm | |
Slew Rate-Nom | 4000 V/us | |
Supply Current-Max | 0.0027 mA | |
Supply Voltage Limit-Max | 7 V | |
Supply Voltage-Nom (Vsup) | 1.8 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | AUTOMOTIVE | |
Terminal Finish | Matte Tin (Sn) | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.65 mm | |
Terminal Position | DUAL | |
Unity Gain BW-Nom | 10 | |
Voltage Gain-Min | 56234 | |
Wideband | NO | |
Width | 3 mm |
MCP6032-E/MSVAO Frequently Asked Questions (FAQ)
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Microchip recommends following a star-grounding layout, keeping the analog and digital grounds separate, and placing the device close to the analog signal sources to minimize noise. Additionally, it's essential to follow proper PCB design practices, such as using a solid ground plane, avoiding vias under the device, and keeping the analog and digital traces separate.
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The MCP6032-E/MSVAO requires a single 2.7V to 5.5V power supply. It's essential to ensure that the power supply is clean and well-regulated. Power sequencing is not critical, but it's recommended to power the device after the analog signal sources are stable to prevent any potential damage or incorrect operation.
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The MCP6032-E/MSVAO can drive up to 1nF of capacitive load. Exceeding this limit can affect the device's stability, bandwidth, and settling time. It's essential to consider the capacitive load when designing the circuit to ensure optimal performance.
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The MCP6032-E/MSVAO has a maximum junction temperature of 150°C. It's essential to ensure good thermal dissipation, especially in high-power or high-temperature applications. A thermal pad is available on the package to help dissipate heat. Follow proper thermal design practices, such as using a heat sink or thermal vias, to keep the device within its thermal limitations.
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The MCP6032-E/MSVAO has built-in ESD protection diodes on all pins. However, it's still essential to follow proper ESD handling and prevention practices during device handling and PCB assembly. Additionally, the device is designed to prevent latch-up, but it's still important to follow proper power sequencing and voltage ramp-up practices to prevent any potential latch-up conditions.