Datasheets
MCP6032-E/MSVAO by: Microchip Technology Inc

Operational Amplifier, 2 Func, 150000uV Offset-Max, CMOS, PDSO8

Part Details for MCP6032-E/MSVAO by Microchip Technology Inc

Results Overview of MCP6032-E/MSVAO by Microchip Technology Inc

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MCP6032-E/MSVAO Information

MCP6032-E/MSVAO by Microchip Technology Inc is an Operational Amplifier.
Operational Amplifiers are under the broader part category of Amplifier Circuits.

Amplifier circuits use external power to increase the amplitude of an input signal. They can be used to perform linear amplifications or logarithmic functions. Read more about Amplifier Circuits on our Amplifier Circuits part category page.

Price & Stock for MCP6032-E/MSVAO

Part # Distributor Description Stock Price Buy
DISTI # MCP6032-E/MSVAO-ND
DigiKey IC OPAMP GP 2 CIRCUIT 8MSOP Lead time: 6 Weeks Container: Tube Temporarily Out of Stock
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DISTI # MCP6032-E/MSVAO
Microchip Technology Inc Dual 1.8V 10kHz Op Amp, E temp, MSOP, Projected EOL: 2044-05-14 COO: Thailand ECCN: EAR99 RoHS: Compliant Lead time: 6 Weeks, 0 Days Container: Tube 0

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Onlinecomponents.com Dual Op Amp - High Precision - 0.9uA - 1.8 to 5.5 VDC - 10KHz GBP - -40°C to 125°C - 8-lead MSOP RoHS: Compliant 0
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Vyrian Amplifiers 644
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Part Details for MCP6032-E/MSVAO

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MCP6032-E/MSVAO Part Data Attributes

MCP6032-E/MSVAO Microchip Technology Inc
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MCP6032-E/MSVAO Microchip Technology Inc Operational Amplifier, 2 Func, 150000uV Offset-Max, CMOS, PDSO8
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Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer MICROCHIP TECHNOLOGY INC
Package Description MSOP-8
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.33.00.01
Factory Lead Time 6 Weeks
Samacsys Manufacturer Microchip
Amplifier Type OPERATIONAL AMPLIFIER
Architecture VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB) 0.005 µA
Bias Current-Max (IIB) @25C 0.0001 µA
Common-mode Reject Ratio-Min 72 dB
Common-mode Reject Ratio-Nom 93 dB
Frequency Compensation YES
Input Offset Voltage-Max 150000 µV
JESD-30 Code S-PDSO-G8
JESD-609 Code e3
Length 3 mm
Low-Bias YES
Low-Offset YES
Micropower YES
Number of Functions 2
Number of Terminals 8
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code TSSOP
Package Equivalence Code TSSOP8,.19
Package Shape SQUARE
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method TUBE
Power NO
Programmable Power NO
Screening Level AEC-Q100; TS 16949
Seated Height-Max 1.1 mm
Slew Rate-Nom 4000 V/us
Supply Current-Max 0.0027 mA
Supply Voltage Limit-Max 7 V
Supply Voltage-Nom (Vsup) 1.8 V
Surface Mount YES
Technology CMOS
Temperature Grade AUTOMOTIVE
Terminal Finish Matte Tin (Sn)
Terminal Form GULL WING
Terminal Pitch 0.65 mm
Terminal Position DUAL
Unity Gain BW-Nom 10
Voltage Gain-Min 56234
Wideband NO
Width 3 mm

MCP6032-E/MSVAO Frequently Asked Questions (FAQ)

  • Microchip recommends following a star-grounding layout, keeping the analog and digital grounds separate, and placing the device close to the analog signal sources to minimize noise. Additionally, it's essential to follow proper PCB design practices, such as using a solid ground plane, avoiding vias under the device, and keeping the analog and digital traces separate.

  • The MCP6032-E/MSVAO requires a single 2.7V to 5.5V power supply. It's essential to ensure that the power supply is clean and well-regulated. Power sequencing is not critical, but it's recommended to power the device after the analog signal sources are stable to prevent any potential damage or incorrect operation.

  • The MCP6032-E/MSVAO can drive up to 1nF of capacitive load. Exceeding this limit can affect the device's stability, bandwidth, and settling time. It's essential to consider the capacitive load when designing the circuit to ensure optimal performance.

  • The MCP6032-E/MSVAO has a maximum junction temperature of 150°C. It's essential to ensure good thermal dissipation, especially in high-power or high-temperature applications. A thermal pad is available on the package to help dissipate heat. Follow proper thermal design practices, such as using a heat sink or thermal vias, to keep the device within its thermal limitations.

  • The MCP6032-E/MSVAO has built-in ESD protection diodes on all pins. However, it's still essential to follow proper ESD handling and prevention practices during device handling and PCB assembly. Additionally, the device is designed to prevent latch-up, but it's still important to follow proper power sequencing and voltage ramp-up practices to prevent any potential latch-up conditions.