Part Details for MCM63R818FC3 by NXP Semiconductors
Overview of MCM63R818FC3 by NXP Semiconductors
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- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for MCM63R818FC3
MCM63R818FC3 CAD Models
MCM63R818FC3 Part Data Attributes
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MCM63R818FC3
NXP Semiconductors
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Datasheet
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MCM63R818FC3
NXP Semiconductors
Late-Write SRAM
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| Part Life Cycle Code | Active | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | BGA, | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.B.2.A | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 1.5 ns | |
| JESD-30 Code | R-PBGA-B119 | |
| Length | 22 mm | |
| Memory Density | 4718592 bit | |
| Memory IC Type | LATE-WRITE SRAM | |
| Memory Width | 18 | |
| Number of Functions | 1 | |
| Number of Terminals | 119 | |
| Number of Words | 262144 words | |
| Number of Words Code | 256000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 256KX18 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Parallel/Serial | PARALLEL | |
| Seated Height-Max | 2.77 mm | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.375 V | |
| Supply Voltage-Nom (Vsup) | 2.5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 14 mm |