There are no models available for this part yet.
Overview of MCM2167L100 by Freescale Semiconductor
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Computing and Data Storage
CAD Models for MCM2167L100 by Freescale Semiconductor
Part Data Attributes for MCM2167L100 by Freescale Semiconductor
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Rohs Code
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No
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Part Life Cycle Code
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Obsolete
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Ihs Manufacturer
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MOTOROLA SEMICONDUCTOR PRODUCTS
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Package Description
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DIP, DIP20,.3
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Reach Compliance Code
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unknown
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ECCN Code
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EAR99
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HTS Code
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8542.32.00.41
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Access Time-Max
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100 ns
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I/O Type
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SEPARATE
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JESD-30 Code
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R-XDIP-T20
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JESD-609 Code
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e0
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Memory Density
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16384 bit
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Memory IC Type
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STANDARD SRAM
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Memory Width
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1
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Number of Terminals
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20
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Number of Words
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16384 words
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Number of Words Code
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16000
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Operating Mode
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ASYNCHRONOUS
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Operating Temperature-Max
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70 °C
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Operating Temperature-Min
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Organization
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16KX1
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Output Characteristics
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3-STATE
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Package Body Material
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CERAMIC
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Package Code
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DIP
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Package Equivalence Code
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DIP20,.3
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Package Shape
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RECTANGULAR
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Package Style
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IN-LINE
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Parallel/Serial
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PARALLEL
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Qualification Status
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Not Qualified
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Supply Voltage-Nom (Vsup)
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5 V
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Surface Mount
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NO
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Technology
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MOS
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Temperature Grade
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COMMERCIAL
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Terminal Finish
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Tin/Lead (Sn/Pb)
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Terminal Form
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THROUGH-HOLE
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Terminal Pitch
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2.54 mm
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Terminal Position
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DUAL
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