Part Details for MCIMX6S5DVM10AB by Freescale Semiconductor
Overview of MCIMX6S5DVM10AB by Freescale Semiconductor
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Industrial Automation
Healthcare
Renewable Energy
Robotics and Drones
Price & Stock for MCIMX6S5DVM10AB
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
|
|
Bristol Electronics | 6 |
|
RFQ |
Part Details for MCIMX6S5DVM10AB
MCIMX6S5DVM10AB CAD Models
MCIMX6S5DVM10AB Part Data Attributes:
|
|
MCIMX6S5DVM10AB
Freescale Semiconductor
Buy Now
Datasheet
|
Compare Parts:
MCIMX6S5DVM10AB
Freescale Semiconductor
i.MX 6 series 32-bit MPU, ARM Cortex-A9 core, 1GHz, MAPBGA 624
|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | FREESCALE SEMICONDUCTOR INC | |
| Package Description | MABGA-624 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A992 | |
| HTS Code | 8542.31.00.01 | |
| Samacsys Manufacturer | NXP | |
| JESD-30 Code | S-PBGA-B624 | |
| JESD-609 Code | e1 | |
| Length | 21 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 624 | |
| Operating Temperature-Max | 95 °C | |
| Operating Temperature-Min | ||
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Equivalence Code | BGA624,25X25,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.5 mm | |
| Supply Voltage-Max | 1.5 V | |
| Supply Voltage-Min | 1.35 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 21 mm | |
| uPs/uCs/Peripheral ICs Type | SoC |