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MCIMX6D4AVT10ACR by:

MICROPROCESSOR

Part Details for MCIMX6D4AVT10ACR by NXP Semiconductors

Overview of MCIMX6D4AVT10ACR by NXP Semiconductors

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Applications Security and Surveillance Audio and Video Systems Transportation and Logistics Healthcare Renewable Energy Automotive Robotics and Drones

Price & Stock for MCIMX6D4AVT10ACR

Part # Distributor Description Stock Price Buy
DISTI # 69W2564
Newark I.mx 6 Series 32-Bit Mpu, Dual Arm Cortex-A9 Core, 1Ghz, Fcbga 624/ Reel Rohs Compliant: Yes |Nxp MCIMX6D4AVT10ACR Min Qty: 500 Package Multiple: 1 Date Code: 0 Container: Reel 0
  • 500 $62.4300
  • 1,000 $61.4000
$61.4000 / $62.4300 Buy Now
DISTI # MCIMX6D4AVT10ACR-ND
DigiKey IC MPU I.MX6D 1.0GHZ 624FCBGA Min Qty: 500 Lead time: 15 Weeks Container: Tape & Reel (TR) Limited Supply - Call
  • 500 $72.9534
$72.9534 Buy Now
DISTI # MCIMX6D4AVT10ACR
Avnet Americas MPU i.MX RISC 32-Bit 1000MHz 1.8V/2.8V/3.3V 624-Pin FCPBGA T/R - Tape and Reel (Alt: MCIMX6D4AVT10ACR) RoHS: Compliant Min Qty: 500 Package Multiple: 500 Lead time: 15 Weeks, 0 Days Container: Reel 0
  • 500 $73.7789
  • 1,000 $72.2310
  • 2,000 $70.1673
  • 3,000 $69.1354
  • 4,000 $67.5876
  • 5,000 $66.0398
  • 50,000 $63.9761
$63.9761 / $73.7789 Buy Now
DISTI # 841-MCIMX6D4AVT10ACR
Mouser Electronics Processors - Application Specialized i.MX 6 series 32-bit MPU, Dual ARM Cortex-A9 core, 1GHz, FCBGA 624 RoHS: Compliant 0
  • 500 $70.1800
$70.1800 Order Now
Future Electronics   RoHS: Compliant pbFree: Yes Min Qty: 500 Package Multiple: 500 Container: Reel 0
Reel
  • 500 $68.8000
$68.8000 Buy Now
DISTI # MCIMX6D4AVT10ACR
Avnet Silica MPU i.MX RISC 32-Bit 1000MHz 1.8V/2.8V/3.3V 624-Pin FCPBGA T/R (Alt: MCIMX6D4AVT10ACR) RoHS: Compliant Min Qty: 500 Package Multiple: 500 Lead time: 17 Weeks, 0 Days Silica - 0
Buy Now
Flip Electronics Stock 61
RFQ

Part Details for MCIMX6D4AVT10ACR

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MCIMX6D4AVT10ACR Part Data Attributes:

MCIMX6D4AVT10ACR NXP Semiconductors
Buy Now Datasheet
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MCIMX6D4AVT10ACR NXP Semiconductors MICROPROCESSOR
Rohs Code Yes
Part Life Cycle Code Not Recommended
Ihs Manufacturer NXP SEMICONDUCTORS
Package Description FCBGA-624
Reach Compliance Code compliant
ECCN Code 5A992.C
HTS Code 8542.31.00.01
Factory Lead Time 15 Weeks
Samacsys Manufacturer NXP
JESD-30 Code S-PBGA-B624
JESD-609 Code e1
Length 21 mm
Moisture Sensitivity Level 3
Number of Terminals 624
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code FBGA
Package Equivalence Code BGA624,25X25,32
Package Shape SQUARE
Package Style GRID ARRAY, FINE PITCH
Peak Reflow Temperature (Cel) 260
Seated Height-Max 2.16 mm
Supply Voltage-Max 1.5 V
Supply Voltage-Min 1.35 V
Surface Mount YES
Technology CMOS
Temperature Grade AUTOMOTIVE
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 40
Width 21 mm
uPs/uCs/Peripheral ICs Type SoC

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