Part Details for MCIMX6D4AVT08AE by NXP Semiconductors
Overview of MCIMX6D4AVT08AE by NXP Semiconductors
- Distributor Offerings: (6 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Security and Surveillance
Audio and Video Systems
Transportation and Logistics
Healthcare
Renewable Energy
Automotive
Robotics and Drones
Price & Stock for MCIMX6D4AVT08AE
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
568-13531-ND
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DigiKey | IC MPU I.MX6D 852MHZ 624FCBGA Min Qty: 300 Lead time: 15 Weeks Container: Tray | Temporarily Out of Stock |
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$63.4228 | Buy Now |
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DISTI #
MCIMX6D4AVT08AE
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Avnet Americas | MPU I.MX 6DUAL RISC 32-Bit 852MHz 1.2V/1.5V/1.8V/2.5V/3.3V 624-Pin FBGA Tray - Trays (Alt: MCIMX6D4AVT08AE) RoHS: Compliant Min Qty: 300 Package Multiple: 300 Lead time: 15 Weeks, 0 Days Container: Tray | 0 |
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$55.6183 / $64.1405 | Buy Now |
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DISTI #
771-MCIMX6D4AVT08AE
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Mouser Electronics | Processors - Application Specialized i.MX 6 series 32-bit MPU, Dual ARM Cortex-A9 core, 850MHz, FCBGA 624 RoHS: Compliant | 0 |
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$62.7800 | Order Now |
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Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 300 Package Multiple: 300 Container: Tray | 0Tray |
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$59.8100 | Buy Now |
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DISTI #
MCIMX6D4AVT08AE
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Avnet Silica | MPU I.MX 6DUAL RISC 32-Bit 852MHz 1.2V/1.5V/1.8V/2.5V/3.3V 624-Pin FBGA Tray (Alt: MCIMX6D4AVT08AE) RoHS: Compliant Min Qty: 60 Package Multiple: 60 Lead time: 17 Weeks, 0 Days | Silica - 0 |
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Buy Now | |
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DISTI #
MCIMX6D4AVT08AE
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EBV Elektronik | MPU I.MX 6DUAL RISC 32-Bit 852MHz 1.2V/1.5V/1.8V/2.5V/3.3V 624-Pin FBGA Tray (Alt: MCIMX6D4AVT08AE) RoHS: Compliant Min Qty: 60 Package Multiple: 60 Lead time: 17 Weeks, 0 Days | EBV - 0 |
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Buy Now |
Part Details for MCIMX6D4AVT08AE
MCIMX6D4AVT08AE CAD Models
MCIMX6D4AVT08AE Part Data Attributes:
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MCIMX6D4AVT08AE
NXP Semiconductors
Buy Now
Datasheet
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Compare Parts:
MCIMX6D4AVT08AE
NXP Semiconductors
Multifunction Peripheral
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | FCBGA-624 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A992.C | |
| HTS Code | 8542.31.00.01 | |
| Factory Lead Time | 15 Weeks | |
| Samacsys Manufacturer | NXP | |
| JESD-30 Code | S-PBGA-B624 | |
| JESD-609 Code | e1 | |
| Length | 21 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 624 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FBGA | |
| Package Equivalence Code | BGA624,25X25,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Seated Height-Max | 2.16 mm | |
| Supply Voltage-Max | 1.5 V | |
| Supply Voltage-Min | 1.35 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 21 mm | |
| uPs/uCs/Peripheral ICs Type | SoC |